Compartment Shielding Layout in Semiconductor Packages for Lower EMI Cost
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Solution Overview
Problem
Conventional compartment shielding in semiconductor packages increases manufacturing costs due to additional materials and processing steps, necessitating a need for improved and cost-effective shielding methods.
Innovation Solution
The implementation of zero-ohm resistors and a conductive shielding layer in semiconductor packages, where the zero-ohm resistors are oriented to form an EMI barrier between compartments, combined with a shielding layer that extends over the package, reduces manufacturing complexity and cost while providing effective electromagnetic interference shielding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If conventional compartment shielding is formed by adding materials and steps during manufacturing, then electromagnetic interference shielding is provided, but manufacturing cost increases
Solution Approach 1:
The patent applies universality by using existing ground traces and shielding layers already present in the semiconductor package for their original purposes, and simultaneously utilizing them as compartment shielding structures. The ground trace serves both as an electrical ground connection and as a shielding barrier, while the shielding layer serves both as EMI protection and as compartment separation, eliminating the need for dedicated shielding materials and steps.
2Object-affected harmful factors
If conventional compartment shielding is formed by adding materials and steps during manufacturing, then electromagnetic interference shielding is provided, but processing complexity increases
Solution Approach 1:
The patent merges the compartment shielding function with existing package structures by combining the ground trace and shielding layer into a unified shielding system. Instead of adding separate shielding components, the invention integrates EMI shielding functionality into the existing ground trace network and shielding layer, thereby reducing processing complexity while maintaining shielding effectiveness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively shields compartments from electromagnetic interference while minimizing material and processing costs, resulting in a more efficient and economical manufacturing process for semiconductor packages.
Implementation Method 1
zero-ohm resistors are oriented to form an EMI barrier between compartments, combined with a shielding layer that extends over the package
Data Source
AI summary
A semiconductor device has a substrate. A first electrical component and second electrical component are disposed over the substrate. A zero-ohm resistor is disposed over the substrate between the first electrical component and second electrical component. An encapsulant is deposited over the substrate, first electrical component, second electrical component, and first zero-ohm resistor. An opening is formed through the encapsulant to the first zero-ohm resistor. A shielding layer is formed over the encapsulant and into the opening.