Compartment Shielding Wirebonds for Semiconductor Package EMI Reduction
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Interference between electronic components in semiconductor package structures affects performance, and existing shielding methods increase package size and complicate soldering accuracy.
Innovation Solution
A semiconductor package structure with a substrate, electronic components, shielding pads, and compartment shielding wirebonds that traverse the components, with vias interposed between bond pairs to enhance shielding effectiveness and reduce package size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a shielding structure is formed on a conductive pad to provide shielding effectiveness, then shielding performance is improved, but the spacing of the semiconductor package structure increases
Solution Approach 1:
The patent divides the shielding structure into multiple segments: compartment shielding wirebonds that create isolated shielding zones between adjacent electronic components. Each wirebond acts as an independent shielding element, allowing effective interference blocking without requiring a continuous large-area shielding layer, thus maintaining compact package dimensions while providing targeted shielding where needed.
2Reliability
If the conductive pad includes a via lower than the surface to improve electrical connection, then electrical conductivity is improved, but soldering accuracy deteriorates when shielding structure is disposed above the via
Solution Approach 1:
The patent resolves the via depth issue by transitioning from a vertical stacking approach to a lateral routing approach. The compartment shielding wirebonds are configured to extend laterally between bonding pads rather than vertically over the via, utilizing the horizontal plane to establish electrical connections. This dimensional shift eliminates soldering accuracy problems caused by via depth while maintaining reliable electrical connectivity through alternative routing paths.
3Object-affected harmful factors
If shielding structure is added to reduce interference between electronic components, then electromagnetic interference is reduced, but device complexity increases
Solution Approach 1:
The patent makes the bonding wires serve multiple functions: they simultaneously provide electrical connectivity between bonding pads and act as compartment shielding elements that block electromagnetic interference. This multi-functionality eliminates the need for separate dedicated shielding structures, reducing overall device complexity while maintaining effective EMI protection between adjacent electronic components.
Data Source
AI summary
A semiconductor package structure includes a substrate structure having a first surface and a second surface opposite to the first surface; at least two electronic components electrically connected to the first surface of the substrate structure; at least one shielding pad disposed on the first surface of the substrate structure; a plurality of vias connected to the at least one shielding pad; a plurality of shielding wirebonds disposed between the electronic components. Each of the shielding wirebonds includes a first bond and a second bond opposite to the first bond, the first bond and the second bond being electrically connected to the at least one shielding pad, and the vias being free from overlapping with any of the plurality of vias.