Compartmental Module Shielding for EMI Isolation in Compact Packages
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Solution Overview
Problem
As electronic modules become smaller due to miniaturization, creating effective shields that do not increase the size of the module is challenging, and there is a need to reduce electromagnetic interference (EMI) from external environments and isolate radiative components within the module.
Innovation Solution
A shielded electronic module design featuring compartmental integrated shielding, which includes a module shielding structure and an electronic module with an interposer, mold compound, device components, and interior shield walls. The interior shield walls are continuous metal sheets that separate device components and are physically and electrically connected to the module shielding structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a grounded enclosure shield is used to block EMI, then electromagnetic interference protection is improved, but the size of the electronic module increases
Solution Approach 1:
The shield is divided into multiple interior shield walls that partition the module interior into separate compartments, each containing specific radiative components. This segmentation provides effective EMI isolation without requiring a large external enclosure, as the shielding function is distributed throughout the module volume rather than added as external bulk.
Solution Approach 2:
The interior shield walls are integrated within the module structure, with the mold compound encapsulating the components and shield walls forming a nested configuration. The shield walls are positioned within the existing module footprint, nesting the shielding function inside the module rather than adding external layers.
2Object-affected harmful factors
If interior shield walls are added to isolate radiative components, then EMI isolation is improved, but the device complexity increases
Solution Approach 1:
The interior shield walls are combined with the mold compound encapsulation process, where the mold compound is applied over the device components and interior shield walls to fully encapsulate them. This merging of the shielding structure with the existing encapsulation process reduces overall device complexity by integrating multiple functions into a single manufacturing step.
Solution Approach 2:
The interior shield walls serve multiple functions: they act as EMI shields, provide structural support within the module, and serve as a foundation for the mold compound encapsulation. This multi-functionality reduces the need for separate components, thereby reducing overall device complexity.
3Object-affected harmful factors
If the shield is made to completely cover the module, then EMI protection is improved, but the manufacturing cost increases
Solution Approach 1:
The interior shield walls are integrated into the mold compound encapsulation process, allowing both the encapsulation and shielding functions to be achieved in a single manufacturing step. This merging eliminates the need for separate shielding installation steps, reducing manufacturing complexity and cost while maintaining complete EMI coverage.
4Object-affected harmful factors
If radiative components are isolated using traditional shields, then EMI is reduced, but the production time increases
Solution Approach 1:
The interior shield walls are positioned and secured to the interposer before the mold compound encapsulation step. This preliminary action allows the shield walls to be in place during component placement and bonding, enabling EMI isolation to be established early in the manufacturing process rather than requiring additional post-assembly shielding steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively reduces EMI from external environments and isolates radiative components within the module, while maintaining a compact size and cost-effective manufacturing process.
Implementation Method 1
When electromagnetic emissions from electronic components within the shield strike the interior surface of the shield, the electromagnetic emissions are electrically shorted through the grounded conductive material, thereby reducing emissions.
Implementation Method 2
The grounded shield then blocks or absorbs incoming or outgoing electromagnetic emissions that could disrupt the electronic components within the enclosure
Implementation Method 3
The mold compound resides over the top surface of the interposer and fully encapsulates the at least one first device component and the at least one second device component
Data Source
AI summary
The disclosure relates to a shielded electronic module with compartmental integrated shielding. The disclosed shielded electronic module includes an electronic module having an interposer, a mold compound, a first device component, a second device component, and an interior shield wall, and a module shielding structure directly and completely covers a top surface and side surfaces of the electronic module. Herein, the first device component and the second device component are formed over a top surface of the interposer, and the mold compound resides over the top surface of the interposer and fully encapsulates the first device component and the second device component. The interior shield wall is a continuous metal sheet and extends vertically through the mold compound towards the top surface of the interposer to separate the first device component and the second device component. The module shielding structure is physically and electrically connected to the interior shield wall.