Complementary Signal Conducting Patterns for High-Frequency PCBs
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Solution Overview
Problem
High frequency signal transmission lines face issues with insertion losses and signal crosstalk due to dielectric material between conductive vias, leading to slower propagation speeds and undesirable parasitic capacitance.
Innovation Solution
A conductive pattern with a pair of terminal portions having circular arc profiles and complementary notches is used, along with an air gap between conductive vias to reduce the dielectric constant and alleviate parasitic capacitance, thereby minimizing insertion loss and enhancing propagation speed.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If dielectric material is used between conductive vias, then structural support and insulation are provided, but parasitic capacitance increases and propagation speed decreases
Solution Approach 1:
The patent applies local quality by creating an air gap specifically between adjacent conductive vias while maintaining dielectric material in other areas. This localized modification reduces parasitic capacitance and increases propagation speed in the critical region between vias, without compromising overall structural support and insulation provided by the dielectric material elsewhere in the circuit board.
2Reliability
If dielectric material is used between conductive vias, then structural support is provided, but insertion loss increases
Solution Approach 1:
The patent reduces insertion loss by introducing an air gap locally between adjacent conductive vias, where parasitic capacitance causes energy loss. The dielectric material is retained in other regions to provide necessary structural support, achieving a balance between mechanical integrity and electrical performance.
3Area of stationary object
If transmission lines are arranged close to each other, then space is utilized efficiently, but signal crosstalk increases
Solution Approach 1:
The patent allows transmission lines to be arranged closely for efficient space utilization while introducing air gaps locally between adjacent conductive vias. This localized modification reduces parasitic capacitance that causes signal crosstalk, enabling close spacing without significant interference.
4Ease of manufacture
If conventional conductive patterns are used, then manufacturing is simple, but high frequency signal transmission performance is poor
Solution Approach 1:
The patent maintains manufacturing simplicity by using standard PCB fabrication processes while introducing a localized air gap feature between adjacent conductive vias. This minimal modification to the conventional structure significantly improves high-frequency signal transmission performance by reducing parasitic capacitance, without requiring complex manufacturing changes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed solution effectively reduces insertion loss and signal crosstalk, increasing propagation speed by creating an air gap with a relative dielectric constant of 1 between conductive vias, which improves the overall performance of high-frequency signal transmission.
Implementation Method 1
insertion losses and signal crosstalk due to dielectric material between conductive vias, leading to slower propagation speeds and undesirable parasitic capacitance
Implementation Method 2
air gap with a relative dielectric constant of 1 between conductive vias
Data Source
AI summary
A conductive pattern has been disclosed. The conductive pattern includes a pair of conductive traces. Each of the conductive traces comprises a linear portion and a terminal portion. The terminal portions are arranged adjacent to each other and comprises a pair of circular arc profile with a pair of complementary notches facing toward each other.