Complex Film Peeling via Inorganic Support Layer
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Solution Overview
Problem
The existing method for manufacturing complex films, such as those used in micro-LED display panels, requires a process that forms projecting anchors on the lower surface to retain the film on the substrate, leading to a productivity issue due to the need for flattening the mounting surface after peeling, which complicates the process and reduces efficiency.
Innovation Solution
An electronic structure and method where a substrate with a support layer made of inorganic material is used, and a complex film with an organic base film and cover layer is formed, allowing for easier peeling by adjusting the contact area between the support layer and the complex film, utilizing the difference in bonding forces between inorganic and organic materials to facilitate separation and mounting without the need for anchor formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If projecting anchors are formed on the lower surface of the complex film to retain the film on the substrate during etching, then the film can be retained on the substrate, but it becomes necessary to execute a process of flattening the mounting surface after peeling the film off, which deteriorates productivity
Solution Approach 1:
The invention extracts the retention function from the complex film itself (by not forming anchors on it) and transfers it to the support layer. The support layer provides retention during etching through its larger contact area, while the complex film can be peeled off with a smooth mounting surface without requiring flattening processes.
Solution Approach 2:
The support layer acts as an intermediary between the substrate and the complex film. It provides the retention function during manufacturing while allowing easy peeling afterward. The support layer mediates between the need for film retention and the need for a smooth mounting surface, eliminating the contradiction by separating these functions.
2Productivity
If a support layer with larger contact area is used instead of forming anchors on the complex film, then the mounting surface remains smooth without flattening, but the mechanism for retaining the film during etching must be provided by the support layer itself
Solution Approach 1:
The invention segments the functions of film retention and mounting surface quality into separate components: the support layer provides retention during etching through its larger contact area, while the complex film maintains its smooth mounting surface. This segmentation allows each component to optimize its specific function without compromising the other.
Solution Approach 2:
The invention changes the contact area parameter of the support layer to be larger than that of the complex film. This parameter change allows the support layer to provide sufficient retention force during etching while enabling easy peeling afterward with a smooth mounting surface, eliminating the need for anchor formation and flattening processes.
3Ease of operation
If the area of the support layer contact surface is made smaller than the complex film surface, then easy peeling is achieved, but the bonding force between inorganic and organic materials must be sufficient to retain the film during the etching process
Solution Approach 1:
The invention applies local quality by making the support layer contact area smaller than the complex film surface area. This local reduction in contact area provides easy peeling capability while the bonding strength is concentrated in the reduced contact region, ensuring sufficient retention during etching. The different material properties (inorganic support layer and organic complex film) are utilized to achieve both strong bonding and easy separation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances productivity by simplifying the peeling and mounting process, maintaining the smoothness of the complex film surface, and allowing for easier handling and mounting on a wiring substrate without the need for surface flattening, thereby improving the efficiency and accuracy of the manufacturing process.
Implementation Method 1
one of part of the functional unit forming the second surface of the protective member and part of the support layer forming the third surface contains organic material as its principal component and the other contains inorganic material as its principal component
Data Source
Figure 1A~1B
Figure 2
Figure 3A~3G
AI summary
An electronic structure (1, 201, 301) includes a substrate (10) having a first surface (10A); a functional unit (2, 202, 302) including a functional section (13, 16, 14) that has an electronic function and a protective member (12, 17, 217) that protects the functional section (13, 16, 14) and having a second surface (2B) formed on the first surface (10A)'s side; and a support layer (11, 211, 311) provided at a position to contact the first surface (10A) and having a third surface (11A) in contact with the second surface (2B) of the functional unit (2), area of the third surface (11A) being smaller than area of the second surface (2B), wherein one of part of the functional unit (2, 202, 302) forming the second surface (2B) of the protective member (12, 17, 217) and part of the support layer (11, 211, 311) forming the third surface (11A) contains organic material as its principal component and the other contains inorganic material as its principal component.