Complex Semiconductor Device Integrating Controller and Memory Chips
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional memory devices, such as single chip and multiple chip integrated circuits, fail to meet the data storage demands of advanced mobile devices, and the collective packaging of multiple memory chips with a controller is inefficient for control and testing, leading to low fabrication efficiency.
Innovation Solution
A complex semiconductor device is designed with multiple memory chips and a controller packaged within a single unit, connected via internal and external buses, allowing for efficient control, testing, and self-diagnosis, enabling flexible operation and integration in mobile devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If multiple memory chips are collectively packaged with a controller in separate packages (MCP and eMMC), then data storage capacity is increased, but control efficiency and testing verification become difficult
Solution Approach 1:
The patent merges the controller and multiple memory chips into a single integrated package structure. The controller is directly mounted on the package substrate alongside the memory chips, eliminating the need for separate MCP and eMMC packages. This integration allows the host to control all memory chips through a single interface, significantly improving control efficiency while maintaining high storage capacity.
2Quantity of substance
If multiple memory chips are packaged separately as MCP and eMMC, then data storage capacity is increased, but fabrication efficiency decreases due to separate testing requirements
Solution Approach 1:
The patent combines the controller and memory chips into one integrated package, allowing all components to be tested together as a single unit during fabrication. This eliminates the need for separate testing of MCP and eMMC packages, significantly improving fabrication efficiency while maintaining the required data storage capacity.
3Ease of manufacture
If conventional separate packaging of memory chips and controller is used, then manufacturing is simpler, but control and testing of multiple chips is inefficient
Solution Approach 1:
The patent segments the package into distinct functional areas: a controller mounting area with dedicated bonding pads, and memory chip mounting areas with their own bonding pads. This segmentation allows each component to be manufactured and tested independently before final integration, maintaining manufacturing simplicity while enabling efficient control and testing of the integrated system.
Data Source
AI summary
Provided is a complex semiconductor device. The complex semiconductor device includes first memory chips in a first package, second memory chips in a second package configured for mass storage of data, and a controller packaged with either the first package or the second package in a complex package. The controller is connected to the first package via a first internal bus and to the second package via a second internal bus, and the first package, second package and controller are commonly packaged within a single complex package.