Compliant Beam Alignment Mechanism for Thermal Head Contact
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing thermal control systems for semiconductor devices face challenges in maintaining uniform contact force and alignment, leading to potential slipping and uneven thermal resistance due to external forces and misalignment, which can result in stress concentrations and reduced thermal conductivity.
Innovation Solution
An alignment mechanism featuring a rigid beam with a high longitudinal stiffness and orthogonal flexibility, allowing for normal force application while accommodating angular misalignment and lateral movement, is integrated with a thermal control device to ensure centralized force distribution and intimate contact between the thermal head and the semiconductor device.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a thermal head applies a large contact force to maximize heat transfer, then thermal conductivity is improved, but the risk of device damage increases
Solution Approach 1:
The patent changes the physical state of the contact interface by introducing a compliant layer between the thermal head and device. This compliant layer deforms under load, distributing the contact force over a larger area and reducing peak stress on the device while maintaining sufficient thermal contact pressure for effective heat transfer.
Solution Approach 2:
The thermal head assembly uses a composite structure combining rigid components (for structural support and thermal conduction) with a compliant layer (for stress distribution and alignment tolerance). This composite design allows the system to achieve both high thermal conductivity and low device damage risk by leveraging the complementary properties of different materials.
2Force
If external forces cause off-center contact force application, then alignment between thermal head and device deteriorates, but increasing contact force can overcome these external forces
Solution Approach 1:
The patent introduces counteracting forces through compliant mounting structures that deflect in response to external forces. These structures generate restoring forces that oppose off-center loading, automatically centering the contact force application point without requiring increased overall contact force.
Solution Approach 2:
The thermal head assembly incorporates dynamic compliance through elastic mounting elements that allow the contact point to shift position in response to external forces. This dynamic adjustment maintains optimal alignment and force distribution under varying load conditions without compromising alignment precision.
3Temperature
If contact surfaces are not in intimate and even contact, then thermal resistance increases, but applying sufficient force to ensure contact may cause stress concentrations
Solution Approach 1:
The patent applies local quality by using a compliant layer specifically at the contact interface where stress concentration would occur. This localized compliance ensures intimate and even contact across the entire surface area, distributing thermal resistance reduction benefits while preventing stress concentration at specific points.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances thermal conductivity by maintaining uniform pressure distribution and reducing the risk of slipping, ensuring effective heat transfer and preventing damage from uneven force application.
Implementation Method 1
The beam is an order of magnitude more rigid along its longitudinal axis than along an axis orthogonal to its longitudinal axis. The second end of the beam allows movement in directions orthogonal to the normal force component
Implementation Method 2
The force is provided to ensure that there is proper heat transfer between the thermal head and the device during testing
Data Source
AI summary
An alignment mechanism is disclosed which includes a mount, a beam having a first end affixed to the mount and a second end. The beam is an order of magnitude more rigid along its longitudinal axis than along an axis orthogonal to its longitudinal axis. The second end of the beam is affixed to a first device having a surface configured to contact a second device. The beam applies a normal force component to the second device through the first device and allows movement at the second end in directions orthogonal to the normal force component.