Compliant Bump Substrate Structure with Metallic Layer
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Solution Overview
Problem
Conventional substrate with gold bumps results in high production costs and poor economic benefits due to the expensive nature of gold.
Innovation Solution
A substrate structure with compliant bumps, featuring insulating bumps and a metallic layer, replaces gold bumps to reduce production costs, where insulating bumps are formed on a substrate with a trace layer and protective layer, and a metallic layer is applied for electric connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If gold bumps are used for electric connection, then reliable electrical connectivity is achieved, but production cost increases significantly
Solution Approach 1:
The bump structure is divided into two functional parts: an insulating bump body (made of inexpensive materials like epoxy or ceramic) and a metallic layer (providing electrical connectivity). This segmentation allows the expensive gold material to be used only where electrically necessary, while the bulk structure uses inexpensive insulating materials, thereby reducing overall production cost while maintaining reliable electrical connection through the metallic layer.
2Ease of manufacture
If insulating bumps are used to replace gold bumps, then production cost is reduced, but electrical connectivity must be maintained
Solution Approach 1:
The bump structure employs composite materials by combining insulating materials (epoxy, ceramic, or plastic) for the bump body with conductive metallic layers (copper, aluminum, or gold plating) for electrical connection. This composite approach allows the insulating portion to reduce material cost while the metallic layer ensures reliable electrical connectivity, effectively resolving the contradiction between cost reduction and connectivity maintenance.
Data Source
AI summary
A substrate structure with compliant bump comprises a substrate, a plurality of bumps, and a metallic layer, wherein the substrate comprises a surface, a trace layer, and a protective layer. The trace layer comprises a plurality of conductive pads, and each of the conductive pads comprises an upper surface. The protective layer comprises a plurality of openings. The bumps are formed on the surface, and each of the bumps comprises a top surface, an inner surface and an outer surface and defines a first body and a second body. The first body is located on the surface. The second body is located on top of the first body. The metallic layer is formed on the top surface, the inner surface, and the upper surface.