Compliant Electromagnetic Shield with Spring Tabs for Thermal Management
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Solution Overview
Problem
Traditional rearview assembly electromagnetic shields often require multiple thermal interfaces, leading to decreased thermal performance and a shorter lifespan due to increased thermal resistance, whereas existing solutions like two-piece shields with lids or pressure locking board level shields do not effectively combine electromagnetic interference shielding with efficient heat dissipation.
Innovation Solution
The design incorporates a compliant electromagnetic shield with spring tabs that make contact with a grounded heat sink and circuit board, using a single thermal pad for improved thermal contact, and includes nested components with retention features for secure assembly, enhancing both electromagnetic shielding and thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If traditional electromagnetic shields use multiple thermal interfaces, then electromagnetic shielding is achieved, but thermal performance decreases and lifespan shortens due to increased thermal resistance
Solution Approach 1:
The patent combines the electromagnetic shielding function and thermal management function into a single integrated component. The shield structure includes thermally conductive material that directly couples the circuit board to the heat sink, eliminating multiple thermal interfaces and reducing thermal resistance while maintaining electromagnetic shielding effectiveness.
Solution Approach 2:
The electromagnetic shield serves multiple functions simultaneously: it provides electromagnetic interference shielding and acts as a thermal conduction path from the circuit board to the heat sink. This multi-functional design eliminates the need for separate thermal management components and reduces the number of thermal interfaces.
2Object-affected harmful factors
If two-piece shields with lids are used, then electromagnetic shielding is provided, but thermal contact and heat dissipation efficiency are insufficient
Solution Approach 1:
The patent merges the shield body and lid into a single monolithic structure with an integrated thermal conduction path. This eliminates the gap and poor thermal contact between separate pieces, providing direct thermal coupling from the circuit board through the shield to the heat sink while maintaining electromagnetic shielding.
3Object-affected harmful factors
If pressure locking board level shields are used, then electromagnetic shielding is achieved, but assembly complexity increases and thermal management is not optimized
Solution Approach 1:
The patent segments the shield into a base portion that integrates with the circuit board and a heat sink interface portion, with the thermal conduction path built into the single component. This segmentation allows for simplified assembly where the shield is installed as one piece rather than multiple components requiring complex pressure locking mechanisms.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves thermal performance by reducing thermal resistance and extending the lifespan of electrical components, while maintaining effective electromagnetic shielding, outperforming traditional designs by allowing better heat transfer from the FPGA chip to the heat sink.
Implementation Method 1
A thermal pad is disposed between and in abutting contact with the circuit board and the grounded heat sink
Implementation Method 2
An electromagnetic shield includes a first component and a second component that is separate and distinct from the first component
Data Source
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AI summary
A rearview assembly having a circuit board. A grounded heat sink is proximate the circuit board. A thermal pad is disposed between and in abutting contact with the circuit board and the grounded heat sink. An electromagnetic shield includes a plurality of spring tabs disposed about a periphery of the electromagnetic shield.