Compliant Heat Transfer Tip for Space-Constrained Cooling
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Solution Overview
Problem
In computers with limited space, heat-sensitive components often experience inadequate cooling due to space constraints, leading to reduced efficiency and premature failure, as traditional cooling methods like forced air or heat sinks are ineffective due to uneven force application on heat transfer tips, causing gaps and reduced heat conduction.
Innovation Solution
A system comprising a mounting plate rigidly connected to a circuit board, a heat sink with bellows devices to maintain contact with the heat-producing component, and a heat pipe with a vaporizable liquid to transfer heat, ensuring constant volume and efficient heat dissipation through a compliant interface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional cooling methods like forced air or heat sinks are used, then cooling capacity is limited, but space constraints prevent adequate cooling of heat-sensitive components
Solution Approach 1:
The patent conducts heat vertically from the heat-sensitive component through a heat transfer tip into a heat pipe, utilizing the vertical dimension to transport heat away from the constrained component area to a separate cooling location, effectively bypassing the horizontal space limitations that plague traditional heat sink approaches
2Reliability
If heat pipe is used to transfer heat, then heat conduction efficiency is improved, but uneven force application on heat transfer tip causes gaps and reduces heat conduction
Solution Approach 1:
The patent employs a compliant heat transfer tip that changes its physical state from rigid to flexible, allowing it to deform and conform to the component surface. This parameter change enables the tip to maintain uniform contact across the entire interface, eliminating gaps caused by manufacturing tolerances or surface irregularities
Solution Approach 2:
The heat transfer tip is constructed as a flexible element that can bend and adapt to the component's surface topology, ensuring consistent thermal contact. This flexibility compensates for variations in component placement and surface flatness, maintaining reliable heat conduction without requiring precision manufacturing
3Reliability
If downward force is increased on heat transfer tip, then contact is improved, but component warping or damage may occur
Solution Approach 1:
The patent transforms the heat transfer tip from a rigid structure to a compliant, flexible element that can deform under load. This parameter change allows the system to achieve stable contact through elastic deformation rather than high compressive force, protecting the component from damage while maintaining reliable thermal connection
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively maintains contact between the heat transfer tip and the component, enhancing heat conduction and preventing premature failure by ensuring a compliant interface and efficient heat dissipation, even in space-constrained environments.
Implementation Method 1
heat pipes include a sealed heat chamber that contains a vaporizable fluid. As a heat producing component heats the heat pipe, the fluid vaporizes, releasing heat from the surface of the fluid
Implementation Method 2
The vapor cools, condenses, and gravity pulls the condensed vapor back to the heat source
Implementation Method 3
heat sink configured to interface with the mounting plate in order to provide a downward force on the heat producing circuit board component
Data Source
AI summary
An apparatus and system are disclosed for cooling of heat producing components. The apparatus may include a mounting plate rigidly connected with a top surface of a circuit board, the mounting plate positioned above a heat producing circuit board component, and a heat sink having first and second ends. The heat sink is configured to interface with the mounting plate in order to provide a downward force on the heat producing circuit board component. The apparatus also includes at least one bellows device coupling a heat transfer tip with the first end of the heat sink, wherein the bellows device is configured to transfer the downward force from the mounting plate to a top surface of the heat producing component and maintain the heat transfer tip in compliance with the plane of the top surface of the heat producing component. The system includes a circuit board, a plurality of heat producing circuit board components, and the described apparatus.