Compliant Heating Plate for Semiconductor Bonding
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Solution Overview
Problem
Traditional rigid heating plates for semiconductor wafers in stud bumping processes face issues with vacuum leakage and mechanical damage due to surface unevenness, leading to potential cratering or peeling of bond pads during bonding.
Innovation Solution
A heating apparatus with a layer of compliant material on the heating plate to secure semiconductor devices, utilizing a holding mechanism and vacuum suction holes to maintain contact and absorb shock, thereby reducing vacuum leakage and mechanical strain.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a rigid heating plate is used to support the semiconductor wafer, then structural stability and heat resistance are improved, but vacuum leakage and mechanical damage (cratering or peeling of bond pads) occur due to surface unevenness
Solution Approach 1:
A flexible membrane layer is introduced between the rigid heating plate and the semiconductor wafer. This membrane conforms to the wafer's back surface contours, eliminating vacuum leakage paths caused by surface unevenness while the rigid heating plate maintains heat resistance. The flexible membrane acts as a compliant interface that adapts to wafer topography.
Solution Approach 2:
The flexible membrane serves as an intermediary element between the rigid heating plate and the semiconductor wafer. It mediates the mechanical interface by providing a conformal contact surface that seals against the wafer's back surface, preventing vacuum leakage without requiring the heating plate itself to be perfectly flat.
2Strength
If a rigid heating plate is used to support the semiconductor wafer, then structural support is improved, but mechanical damage (cratering or peeling of bond pads) occurs during bonding
Solution Approach 1:
The flexible membrane layer absorbs mechanical shocks and stresses during the bonding process, preventing them from being transmitted to the semiconductor wafer. This eliminates cratering and peeling of bond pads while the rigid heating plate below continues to provide structural support and heat resistance.
Solution Approach 2:
The flexible membrane provides preemptive cushioning between the rigid heating plate and the semiconductor wafer. It is positioned in advance to absorb and distribute mechanical stresses before they can cause damage to the bond pads during the bonding process.
3Force
If vacuum suction is applied directly to the heating plate surface, then wafer holding force is improved, but vacuum leakage occurs due to surface non-conformity
Solution Approach 1:
The flexible membrane creates a conformal seal between the vacuum source and the semiconductor wafer. It adapts to the wafer's back surface topology, ensuring that vacuum suction force is effectively transmitted without leakage paths, thereby maintaining strong wafer holding force.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The compliant material layer enhances bonding accuracy and quality by maintaining consistent vacuum suction and reducing mechanical stress, preventing cratering and peeling of bond pads.
Implementation Method 1
a heating plate for heating the semiconductor device
Implementation Method 2
A plurality of vacuum holes are included on the surface of the heating plate to exert vacuum suction force for securing the wafer on the heating plate
Data Source
AI summary
A heating apparatus and method for heating a semiconductor device during bonding of electrical contacts onto the device is provided, which includes a heating plate that is provided for heating the semiconductor device and a layer of compliant material extending over at least a portion of the heating plate for mounting the semiconductor device. A holding mechanism secures the semiconductor device on the layer of compliant material during bonding of electrical contacts onto the semiconductor device while it is being heated by the heating plate.