Compliant Leadframes for High-Power Component-on-Package Thermal Management
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Solution Overview
Problem
High power density systems-in-packages face challenges in integrating large power components due to size limitations and heat dissipation, which can lead to thermal and current carrying capacity issues on system boards without additional metal layers or costly heat sinks.
Innovation Solution
The integration of mechanically compliant and highly conductive leadframes within the module package that provide both electrical and thermal pathways, allowing for the attachment of large external components while absorbing and redirecting compressive forces, and enhancing heat dissipation through spring-like cushioning and additional thermal pathways.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If large power components are integrated into the SIP package, then power handling capability is improved, but package size increases and thermal mass increases
Solution Approach 1:
The leadframe extends vertically through the mold compound to provide a third-dimensional pathway for both electrical connection and thermal dissipation. This vertical dimension allows large power components to be mounted on the system board while maintaining compact SIP footprint, as the thermal and electrical pathways utilize the Z-axis rather than requiring additional planar space.
Solution Approach 2:
The leadframe serves multiple functions simultaneously: it provides electrical connection between the component and package circuitry, acts as a thermal conduction pathway to dissipate heat, and functions as a mechanical support structure. This multi-functionality eliminates the need for separate dedicated thermal vias, electrical traces, and mechanical mounts, thereby reducing overall package volume.
2Power
If large power components are used, then power capability is improved, but board space requirements increase
Solution Approach 1:
By utilizing the vertical dimension through the mold compound, the invention allows power components to remain mounted on the board while the SIP package maintains a compact footprint. The leadframe's vertical extension enables thermal and electrical pathways without requiring expanded planar board real estate.
3Power
If high current pathways are provided, then power capability is improved, but heat dissipation requirements increase
Solution Approach 1:
The invention merges the electrical current pathway and thermal heat pathway into a single integrated leadframe structure. The same conductive material that carries high current also conducts heat away from the component, eliminating the need for separate thermal management systems and reducing overall thermal mass while maintaining high power capability.
Solution Approach 2:
The leadframe simultaneously serves as both an electrical conductor for high current and a thermal conductor for heat dissipation. This dual functionality allows the system to handle high power loads while effectively managing the associated heat generation without requiring additional dedicated thermal pathways.
4Power
If additional metal layers and solid metal vias are used, then heat and current carrying capacity is improved, but device complexity and cost increase
Solution Approach 1:
The invention extracts the thermal and electrical pathway functions from the substrate architecture and consolidates them into a single leadframe component. This eliminates the need for additional metal layers, solid metal vias, and complex substrate modifications, thereby reducing device complexity and manufacturing cost while maintaining high power capability.
5Temperature
If heat is dissipated into the system board, then thermal management is simplified, but adjacent packages and components are affected
Solution Approach 1:
The invention extracts the heat dissipation pathway from the system board and redirects it through the leadframe to external heat sinks or other designated thermal management locations. This isolation prevents heat from being dissipated into the board and affecting adjacent packages and components, thereby eliminating thermal interference while maintaining effective heat dissipation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables efficient heat dissipation and improved power handling by providing a high current and thermal conductive connection, maintaining system reliability and efficiency while minimizing board real estate impact.
Implementation Method 1
The leadframe may have a high degree of both electrical and thermal conductivity
Implementation Method 2
a non-planar shape that provides spring-like cushioning of force applied to the component in the direction of the circuit module
Data Source
AI summary
A component-on-package circuit may include a component for an electrical circuit and a circuit module attached to the component. The circuit module may have circuitry and at least one leadframe which connects the circuitry to the component both electrically and thermally. The leadframe may have a high degree of both electrical and thermal conductivity and a non-planar shape that provides spring-like cushioning of force applied to the component in the direction of the circuit module.