Compliant Plug Interconnect for Variable Pin Insertion Depths

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Solution Overview

Problem

Existing interconnects face reliability and consistency issues due to varying pin insertion depths and manufacturing variances, leading to high resistance and unreliable electrical connections, especially at shallow insertion depths.

Innovation Solution

The interconnect design features a recess with a distributed metallized layer on the axial end wall and side wall, combined with a conductive compliant plug, which facilitates a consistent and low-resistance electrical connection by providing multiple conductive paths regardless of insertion depth, using materials like conductive polymer, foamed metal, or conductive foamed plastic.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a conventional interconnect design is used, then the structure is simple, but the electrical connection reliability deteriorates due to varying pin insertion depths and manufacturing variances

Engineering Contradiction:
Improveelectrical connection reliabilityVSAvoidinterconnect structure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The interconnect structure is segmented into distinct functional zones: a recess region with distributed metallized layers and a compliant plug region. This segmentation allows each zone to perform its specific function - the metallized layers provide multiple conductive paths while the compliant plug accommodates insertion depth variations, thereby improving reliability without requiring complete structural redesign

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

A compliant plug material is introduced as an intermediary between the pin and the conductive pad. This intermediary material deforms to accommodate variations in pin insertion depth, ensuring consistent electrical contact. The compliant plug acts as a buffer that absorbs manufacturing tolerances and insertion depth variations, maintaining reliable electrical connection

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If the pin insertion depth is shallow, then the assembly is easier, but the electrical resistance increases and connection reliability deteriorates

Engineering Contradiction:
Improveelectrical connection consistencyVSAvoidinsertion depth control
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The compliant plug is designed to be dynamically deformable, allowing it to adapt its shape based on the pin insertion depth. When the pin is inserted, the compliant plug deforms to make contact with the conductive pad, ensuring consistent electrical connection regardless of whether the insertion depth is shallow or deep. This dynamic adaptation eliminates the need for precise insertion depth control

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The electrical resistance parameter is changed by providing multiple metallized layers at different positions within the recess. These distributed metallized layers create multiple parallel conductive paths, reducing overall resistance and ensuring low resistance connection even when the pin contact point varies due to insertion depth variations

Inventive Principle:
Principle #35Parameter changes

3Reliability

If distributed metallized layers are added to the recess, then the electrical connection reliability improves, but the manufacturing complexity increases

Engineering Contradiction:
Improveelectrical connection consistencyVSAvoidmanufacturing process simplicity
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The distributed metallized layers are pre-formed within the recess during the interconnect manufacturing process, before the compliant plug is inserted. This preliminary action ensures that the conductive paths are already in place and properly positioned, simplifying the assembly process. The compliant plug is then simply inserted to complete the connection, making the overall manufacturing process straightforward despite the complex metallized layer structure

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration ensures a reliable and consistent electrical connection across all insertion depths, reducing resistance to less than 1 Ohm and minimizing failures due to manufacturing variances, making the interconnects suitable for dense arrays in electronics.

Implementation Method 1

a distributed metallized layer disposed on the axial end wall and the side wall and a conductive compliant (CC) plug disposed within the recess to interface with the metallized layer. The CC plug can be configured to establish an electrical connection between a conductive pad disposed in the recess and a male conductive element inserted into the recess via the metallized layer

Methodology Applied
Scientific EffectElectrical conduction: Conduction (electrical)

Implementation Method 2

The CC plug can be configured to establish an electrical connection between a conductive pad disposed in the recess and a male conductive element inserted into the recess via the metallized layer

Methodology Applied
Scientific EffectElastic deformation: Elasticity

Data Source

PatentUS12171064B2Interconnect and method for manufacturing the same
Publication Date: 2024.12.17 RAYTHEON CO
  • US12171064B2 patent drawing
  • US12171064B2 patent drawing
  • US12171064B2 patent drawing

AI summary

An interconnect is provided that can comprise a recess formed in a body where the recess comprises an axial end wall and a side wall extending from the axial end wall. The interconnect can also comprise a distributed metallized layer disposed on the axial end wall and the side wall and a conductive compliant (CC) plug disposed within the recess to interface with the metallized layer. The CC plug can be configured to establish an electrical connection between a conductive pad disposed on the recess and a male conductive element inserted into the recess via the metallized layer.