Compliant Test Probe Structure to Prevent Test Pad Damage

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Solution Overview

Problem

Conventional probing methods for semiconductor devices often cause damage to the testing surface, such as scratches and burrs on contact pads, which complicates the hybrid bonding process and increases fabrication costs.

Innovation Solution

The use of deformable electrical testing probes with conductive polymers and protective tips, optionally embedded with inductive elements, that are formed through additive manufacturing or molding processes, allowing for elastic deformation to minimize contact damage.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional rigid probing methods are used to test semiconductor devices, then electrical functionality can be tested, but the testing surface is damaged causing scratches and burrs on contact pads

Engineering Contradiction:
Improveelectrical functionality testingVSAvoidsurface damage
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent changes the mechanical parameter of the probe from rigid to compliant by using elastomeric material with specific durometer hardness (20-80 Shore A). This parameter change allows the probe to deform elastically during contact, distributing pressure and preventing concentrated stress that causes scratches and burrs on contact pads, while still maintaining sufficient electrical contact for testing.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent employs composite material structure combining elastomeric base material with embedded conductive elements (metal particles, conductive fabric, or conductive polymer). This composite structure provides both the mechanical compliance of the elastomer and the electrical conductivity needed for testing, resolving the contradiction between soft contact and electrical functionality.

Inventive Principle:
Principle #40Composite materials

2Object-affected harmful factors

If compliant probes with lower hardness are used to minimize surface damage, then probe marks are reduced, but the probe may lack sufficient structural strength

Engineering Contradiction:
Improveprobe marksVSAvoidprobe structural strength
Core Design Contradiction:
Object-affected harmful factorsVSStrength

Solution Approach 1:

The elastomeric probe incorporates embedded conductive elements within the compliant matrix. The elastomer provides the necessary compliance to minimize probe marks, while the embedded conductive particles or fabric provide structural reinforcement and maintain electrical conductivity, achieving both soft contact and sufficient strength.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The probe design applies different material properties to different regions: the bulk elastomeric material provides overall compliance and shock absorption to minimize surface damage, while the embedded conductive elements provide localized structural strength and electrical conductivity at the contact point, creating a spatially differentiated material structure.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The deformable probes reduce or eliminate probe marks on semiconductor devices, eliminating the need for additional processing and reducing fabrication costs by ensuring complete contact without damaging the test pads.

Implementation Method 1

The conductive probe is elastically deformable

Methodology Applied
Scientific EffectElastic deformation: Elasticity

Data Source

PatentUS20260056229A1Compliant test probe
Publication Date: 2026.02.26 ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC
  • US20260056229A1 patent drawing
  • US20260056229A1 patent drawing
  • US20260056229A1 patent drawing

AI summary

A deformable electrical testing probe is disclosed. The testing probe can include a base test structure having an electrically conductive layer comprising one or more metallic conductors. The testing probe can further include a conductive probe having an electrically conductive polymer on the one or more metallic conductors of the electrically conductive layer. The conductive probes can include a tip opposite from the electrically conductive layer, and the tip can include a conductive tip layer having a hardness greater than that of the conductive probes. One or more conductive filaments can be embedded within the conductive probes. The conductive probes can include a reinforcing material embedded within the conductive probes. The reinforcing material within the conductive probe can be a composite material and/or a metallic element. The conductive probe can be elastically deformable. The deformable electrical testing probe can minimize or eliminate probe marks on a tested device.