Compliant Processor Socket Lid for Uniform Contact Compression
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Traditional processor socket assemblies face challenges in maintaining uniform compression across the contact field due to increasing contact density and size of processors, leading to non-uniform contact pressure and manufacturing complexity, especially with the need for compatible electrical and mechanical requirements with printed circuit boards.
Innovation Solution
A compliant lid design that applies force uniformly across the contact field by distributing pressure closer to the center of the processor, using a structure with thicker outer portions and thinner inner portions, and strategically placed openings to enhance compliance and reduce corner compression, allowing for more efficient force distribution without complex curved plates or stepped insulators.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional rigid lid structures are used to apply force to the processor, then the structure is simple to manufacture, but the compression is non-uniform across the contact field leading to poor reliability
Solution Approach 1:
The lid structure transitions from a rigid configuration to a compliant configuration by modifying the mechanical properties of the material or structure. The compliant lid can deform elastically under applied force, allowing it to conform to the processor surface and distribute compression uniformly across all contact points, thereby improving reliability without significantly increasing manufacturing complexity.
Solution Approach 2:
The lid is designed to be dynamically compliant rather than statically rigid. When force is applied through the retention mechanism, the lid dynamically adjusts its shape to match the processor contours, ensuring uniform contact pressure across the entire contact field. This dynamic adaptation enhances connection reliability while maintaining a relatively simple overall structure.
2Reliability
If force is applied at the corners of the lid to secure the processor, then the retention mechanism is simple, but the corner compression causes non-uniform pressure distribution
Solution Approach 1:
By changing the compliance parameter of the lid, the system transforms how force is transmitted. Instead of direct corner-to-corner force transmission that creates pressure concentration, the compliant lid distributes the applied force through elastic deformation, achieving uniform pressure across the contact field while retaining simple corner-based retention mechanisms.
Solution Approach 2:
The compliant lid acts as an intermediary between the retention mechanism and the processor contacts. When force is applied at the corners through the retention mechanism, the compliant lid mediates this force distribution, transforming concentrated corner forces into uniform distributed pressure across all contact points, thereby achieving reliable compression without complex force application mechanisms.
3Reliability
If complex curved plates or stepped insulators are used to achieve uniform compression, then uniform compression is achieved, but the manufacturing complexity increases significantly
Solution Approach 1:
Instead of using complex geometric shapes like curved plates or stepped insulators, the invention achieves uniform compression by changing the compliance parameter of a relatively simple lid structure. The compliant material or structure can deform to accommodate processor variations, providing uniform pressure distribution without requiring complex manufacturing processes.
Solution Approach 2:
The compliant lid functions similarly to a flexible shell that can deform under load. This flexible structure adapts to the processor surface geometry and distributes force uniformly across the contact field, achieving the same effect as complex rigid structures but with much simpler manufacturing. The flexible nature allows a single-piece construction without complex curves or steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The compliant lid design ensures uniform compression and robust contact engagement, reducing the risk of overstress and manufacturing complexity, while maintaining compatibility with PCB requirements and enhancing the reliability of electrical connections.
Implementation Method 1
a compliant lid configured to press a processor against a socket along a vertical direction
Data Source
AI summary
Compliant lids for processor socket assemblies are described. The compliant lids described herein ensure uniform compression across the contact field notwithstanding the recent trend to continue to increase the physical dimension of the socket and the density of contacts. Compression uniformity can be enhanced by relocating the pressure exerted on the package away from the corners of the package. This can be accomplished by designing the compliant lids to have openings shaped to interrupt the continuous material that would otherwise extend from the corner of the lid to the region where the lid engages the processor. This void of material is shaped so that continual presence of material exists primarily in the region where the force delivery is preferred. Use of such compliant lids can enhance compression uniformity without having to rely on complex curved plates and stepped insulators.