Compliant Thermal Contact Device for Semiconductor Testing

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Solution Overview

Problem

Variations in chip height on semiconductor devices complicate direct thermal contact during elevated temperature testing, making it difficult to simultaneously test multiple chips using conventional test fixtures.

Innovation Solution

The use of interleaved thermally conducting structures with a biasing mechanism and thermal interface materials in a compliant thermal contact device allows for adjustable contact, ensuring consistent thermal conduction across chips of varying heights, even in non-linear configurations.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If direct contact test fixtures are used to conduct heat to chips, then thermal conduction efficiency is improved, but the ability to accommodate chip height variations deteriorates

Engineering Contradiction:

Improvethermal conduction efficiencyVSAvoidaccommodation of chip height variations

Core Design Contradiction:

TemperatureVSAdaptability or versatility

Solution Approach 1:

The patent employs a compliant thermal contact device with a flexible structure that can deform to match varying chip heights. The device includes a substrate with thermal contact elements that can flex and conform to the topography of different chip positions, ensuring consistent thermal contact across chips of non-uniform heights while maintaining effective heat conduction.

Inventive Principle:

Principle #30Flexible shells and thin films

Solution Approach 2:

The patent utilizes phase change materials or materials with variable thermal properties that can adapt to different contact conditions. The compliant thermal contact device incorporates materials whose physical properties change under different temperature or pressure conditions, allowing the device to automatically adjust its contact characteristics to accommodate chip height variations while maintaining thermal conduction efficiency.

Inventive Principle:

Principle #35Parameter changes

2Stability of the object's composition

If conventional rigid test fixtures are used, then structural stability is improved, but the ability to make contact with all chips simultaneously deteriorates

Engineering Contradiction:

Improvestructural stabilityVSAvoidcontact consistency across multiple chips

Core Design Contradiction:

Stability of the object's compositionVSReliability

Solution Approach 1:

The patent divides the thermal contact device into multiple independent or semi-independent contact elements arranged on a substrate. Each contact element can independently deform and conform to the height of individual chips, ensuring reliable contact with all chips simultaneously. The segmented structure allows local adaptation while maintaining overall structural stability through the substrate framework.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent transitions from a static rigid fixture to a dynamic compliant structure that can adapt its shape and contact pressure. The compliant thermal contact device incorporates flexible elements that can dynamically adjust their position and deformation in response to varying chip heights, ensuring consistent contact across all chips while the substrate provides overall structural stability.

Inventive Principle:

Principle #15Dynamics

3Adaptability or versatility

If chip heights vary on the substrate, then manufacturing flexibility is improved, but the difficulty of making direct thermal contact increases

Engineering Contradiction:

Improvemanufacturing flexibilityVSAvoiddifficulty of making direct thermal contact

Core Design Contradiction:

Adaptability or versatilityVSDifficulty of detecting and measuring

Solution Approach 1:

The patent introduces a compliant thermal contact device as an intermediary between the heat source and the chips. This intermediary device absorbs the height variations and irregularities, providing a uniform thermal interface across all chips. The compliant substrate acts as a mediator that translates the varied chip heights into consistent contact conditions, eliminating the difficulty of making direct thermal contact with non-uniform chip surfaces.

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration provides reliable and repeatable thermal contact across multiple chips, maintaining high thermal conductivity and accommodating manufacturing variances, thereby enabling effective thermal testing of semiconductor devices.

Implementation Method 1

The device contact pad includes a first number of conducting structures protruding from the device contact pad. The heat distributing pad includes a second number of conducting structures protruding from the heat distributing pad... maintaining high thermal conductivity

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS9791501B2Compliant thermal contact device and method

Publication Date: 2017.10.17 INTEL CORP

AI summary

Examples of thermal contact devices and methods are shown. Compliant thermal contact devices are shown that include interleaved conducting structures to provide a high thermal conduction contact area. Selected examples include a thermal interface material located at the interleaved interface between the conducting structures. Selected examples also include designs for alternate chip orientations.