Compliant Thermal Contactor With Posts For Low-Pressure Thermal Contact
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Solution Overview
Problem
Existing thermally conductive silicone pads require high pressure for effective thermal contact between heat sources and heat dissipaters, leading to issues with residue formation during device testing and compromised thermal conductivity due to thick pad thickness.
Innovation Solution
A compliant thermal contactor with thermally conductive, compliant posts on a resilient metal film, allowing for vertical compression and lateral expansion to achieve intimate contact with reduced pressure, thereby enhancing thermal conductivity and preventing residue formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If thermally conductive silicone pads are used to bond heat sources to heat dissipaters, then thermal contact is achieved, but high pressure (40-50 psi) is required to distort the pad laterally to fill voids at interfaces
Solution Approach 1:
The patent changes the material parameter from low modulus silicone to high modulus elastomeric material. This parameter change allows the material to maintain structural integrity while still providing compliance, reducing the lateral distortion needed to fill voids and thereby reducing the bonding pressure from 40-50 psi to lower levels.
Solution Approach 2:
The patent uses composite materials by combining elastomeric material with thermally conductive fillers. This creates a material that simultaneously provides mechanical compliance for void filling and high thermal conductivity, eliminating the need for high pressure while maintaining effective thermal contact.
2Temperature
If low modulus silicone material is used to enable lateral distortion for filling voids, then intimate contact is achieved, but the pad thickness must be relatively large which compromises thermal conductivity
Solution Approach 1:
The patent changes the modulus parameter from low to high, enabling the material to achieve void filling through elastic compliance rather than requiring large thickness. The high modulus elastomeric material can distort laterally effectively with thinner cross-section, allowing reduced pad thickness while maintaining both void filling capability and thermal conductivity.
3Temperature
If prior art thermally conductive silicone pads are used in device testing applications, then thermal contact is provided, but residues are left after high temperature operation of chips
Solution Approach 1:
The patent applies the disposable principle by designing the elastomeric pad to be replaceable after high temperature testing operations. The pad can be removed and discarded after use, preventing residue contamination of the chip and heat spreader surfaces. This allows repeated testing cycles without cumulative residue buildup, maintaining clean interfaces for optimal thermal contact.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The compliant thermal contactor reduces the pressure required for effective thermal contact, increases thermal conductivity, and minimizes residue formation during high-temperature operations, making it suitable for device testing and heat management applications.
Implementation Method 1
allowing for vertical compression and lateral expansion to achieve intimate contact
Implementation Method 2
such thermally conductive silicone pads... require a high pressure... to distort the silicone pad laterally by an amount sufficient to fill voids
Implementation Method 3
a plurality of first thermally conductive, compliant posts disposed in an array on a top side thereof and a plurality of second thermally conductive, compliant posts disposed in an array on a bottom side
Data Source
AI summary
One embodiment of the present invention is a compliant thermal contactor that includes a resilient metal film having a plurality of first thermally conductive, compliant posts disposed in an array on a top side thereof and a plurality of second thermally conductive, compliant posts disposed in an array on a bottom side thereof.