Compliant Thermal Interface with Flexible Diaphragm Cooling
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Solution Overview
Problem
Existing thermal management systems face inefficiencies due to misalignment and geometric variations between heat-dissipating components and heat-receiving structures, leading to increased thermal resistance and degradation of elastomeric gap fillers over time.
Innovation Solution
A thermal management device comprising a housing, diaphragm, and wick that accommodates geometric variations through resilient flexibility, using a flexible diaphragm to maintain contact with heat-dissipating components and facilitate efficient heat transfer via an evaporation and condensation loop.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If elastomeric gap filler or thermal paste is used to fill gaps, then thermal path is partially restored, but thermal resistance remains higher compared to perfect alignment and materials degrade over time
Solution Approach 1:
The diaphragm is designed to be resiliently flexible, allowing it to dynamically adapt to geometric variations and maintain optimal contact with heat-dissipating components. This dynamic capability eliminates the need for static gap fillers while maintaining low thermal resistance through sustained solid-to-solid contact.
Solution Approach 2:
The diaphragm functions as a flexible thin film structure that can deform to accommodate misalignments and geometric variations. This flexibility enables the diaphragm to maintain conformal contact with heat-dissipating components, providing both mechanical compliance and thermal conduction without the degradation issues of elastomeric materials.
2Stability of the object's composition
If rigid housing structure is used, then structural stability is maintained, but geometric variations cause misalignment and increased thermal resistance
Solution Approach 1:
The diaphragm introduces a dynamic element between the rigid housing and heat-dissipating components. This dynamic interface can deform to compensate for manufacturing tolerances and geometric variations, maintaining alignment precision without compromising the structural stability of the rigid housing.
Solution Approach 2:
The diaphragm's resilient flexibility allows it to change its physical parameters (shape, position) in response to geometric variations. This parameter change capability enables the system to accommodate misalignments while maintaining stable thermal contact, bridging the gap between rigid structural stability and alignment precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device reduces thermal resistance and maintains efficient heat transfer by accommodating misalignments and variations, providing durable and efficient cooling for heat-dissipating components.
Implementation Method 1
the diaphragm resiliently flexible relative to the housing and the at least one support to bias the contact surface of the diaphragm away from the chamber
Implementation Method 2
a fluid within the chamber may evaporate and condense along the chamber to transfer heat away from one or more heat-dissipating components
Implementation Method 3
a fluid within the chamber may evaporate and condense along the chamber to transfer heat away from one or more heat-dissipating components
Implementation Method 4
a fluid within the chamber may evaporate and condense along the chamber to transfer heat away from one or more heat-dissipating components
Data Source
AI summary
Thermal management devices, systems, and methods of fabrication thereof are generally directed to accommodating variability in height, shape, or other geometric features of one or more heat-dissipating components on a substrate while maintaining efficient transfer of heat away from the one or more heat-dissipating components. For example, a thermal management device may include a housing, a diaphragm, and a wick, the wick disposed along a chamber defined by the housing and the diaphragm such that a fluid within the chamber may evaporate and condense along the chamber to transfer heat away from one or more heat-dissipating components (e.g., electronic components or photonics). The diaphragm may be resiliently flexible relative to the housing to bias a contact surface of the diaphragm against one or more heat-dissipating components while maintaining efficient transfer of heat through the chamber and away from the one or more heat-dissipating components.