Electronic Component Alignment Structure for Rotation-Free PCB Mounting
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Solution Overview
Problem
The multi-phase mounting process for orientation-sensitive electronic dies is prone to inaccuracy, requiring complex calibration steps and rotations of the circuit board to align the die correctly with the desired measurement axis.
Innovation Solution
The electronic component is designed with aligning structures on its outer surface, which include first and second aligning surface areas, configured to prevent rotation and ensure precise alignment with the circuit board, thereby accurately aligning the axis of interest with the surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the multi-phase mounting process is used for orientation-sensitive electronic dies, then the die can be mounted on the circuit board, but the alignment accuracy between the die and the measurement axis deteriorates due to accumulated errors from multiple mounting steps
Solution Approach 1:
The patent applies preliminary action by pre-aligning the die with the package during the packaging phase, rather than attempting alignment during final circuit board mounting. The die is positioned and fixed in the correct orientation relative to the package structure before the package is completed, so that when the packaged component is later mounted on the circuit board, the alignment is already established and does not require complex calibration or rotation steps.
Solution Approach 2:
The patent segments the alignment function into two independent parts: (1) die-to-package alignment performed during packaging, and (2) package-to-circuit-board mounting performed during assembly. By separating these alignment tasks, the patent eliminates the accumulation of alignment errors that would occur if all alignment were attempted in a single multi-phase mounting process.
2Manufacturing precision
If calibration is performed in connection with the final phase mounting the circuit board to the apparatus, then the alignment can be compensated, but the manufacturing time increases
Solution Approach 1:
The patent eliminates the need for time-consuming calibration by performing the alignment action in advance during the packaging process. The die is pre-aligned with the package structure, and this alignment is maintained through subsequent mounting operations, so no additional calibration time is required during final assembly or manufacturing.
3Manufacturing precision
If the circuit board is rotated to align the die accurately with the measurement axis, then the alignment accuracy improves, but the device complexity and manufacturing steps increase
Solution Approach 1:
The patent applies preliminary action by establishing the correct orientation of the die relative to the package during packaging, so that the die's measurement axis is pre-aligned with the package's reference features. This eliminates the need for subsequent rotation or reorientation of the circuit board, as the alignment is already correct when the packaged component is mounted in its standard orientation.
Data Source
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Figure 7~8
AI summary
An electronic component (1) is configured to be mounted on an external surface (21), which surface (21) defines a plane (22). The electronic component (1) comprises at least one electronic chip (2) housed within package (3). The electronic component (1) is provided with one or more aligning structures (5), which aligning structure(s) (5) are formed on an outer surface (6) of the electronic component (1). The aligning structure(s) (5) define at least two first aligning surface areas (7) in a first direction (8) and at least two second aligning surface areas (9) in a second direction (10). The first aligning surface areas (7) and the second aligning surface areas (9) are formed and spaced from each other in such a manner that at least a rotation of the electronic component (1) about an axis (11) perpendicular to the plane (22) defined by the surface (21) is prevented, when the first aligning surface areas (7) and the second aligning surface areas (9) are provided against counter surfaces (23) fixed on the surface (21) and conforming at least partly to the form of the respective aligning surface areas (7, 9).