Electronic Component Alignment Using Through-Transmission Features
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In semiconductor pick-and-place applications, the alignment of electronic components with irregular shapes is challenging due to the lack of direct correlation between top and bottom surfaces, especially when external physical edges are rough and slanted, making precise alignment difficult.
Innovation Solution
A method and system that utilize a light source and camera units to illuminate and image both surfaces of the electronic component, calculating a correction value to adjust the placement area, allowing for accurate alignment based on internal features visible through the component, even when external features are not sufficient or correlated.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If alignment is based on outer physical edges of the component, then alignment process is simple, but alignment precision deteriorates due to roughness and slanted sides caused by dicing process
Solution Approach 1:
The patent extracts the alignment task from the outer physical edges (which are rough and slanted) and relocates it to internal structures visible through the component body. The light source illuminates through the component to make internal structures visible, allowing alignment based on these internal features rather than the problematic outer edges.
Solution Approach 2:
The patent introduces light as an intermediary medium to visualize internal structures that are not directly observable. The light source unit shines through the component body, and the camera captures the illuminated internal structures, creating a visual intermediary that enables precise alignment without直接接触 the rough outer edges.
2Reliability
If alignment structures are required on both top and bottom surfaces, then alignment between top and bottom is possible, but device complexity increases and not all devices have such structures
Solution Approach 1:
The patent creates a visual copy of the internal structures through optical illumination. The camera captures an image of the internal structures illuminated from the back, creating a 2D visual representation that can be processed for alignment without requiring physical alignment structures on both surfaces. This optical copy enables alignment reliability without adding physical complexity.
3Ease of operation
If external physical edges are used for alignment, then alignment process is straightforward, but alignment accuracy deteriorates due to lack of correlation between top and bottom surfaces
Solution Approach 1:
The patent transitions from 2D edge-based alignment to 3D internal structure-based alignment. By illuminating through the component body and capturing internal structures, the system accesses information from another dimension (through-transmission view) that reveals the true positional relationship between top and bottom surfaces, enabling accurate placement despite the straightforward appearance of the method.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables precise alignment of electronic components by using internal features for alignment, improving accuracy and robustness, particularly for components like mini-LEDs with rough and slanted edges, ensuring correct assembly by adjusting the placement area based on calculated corrections.
Implementation Method 1
illuminating, using a light source unit, the electronic component with light which transmits through the electronic component
Data Source
Figure 1
Figure 2~3
Figure 4~5
AI summary
The present disclosure relates to a technology of manufacturing electronic components, especially semiconductor components with an irregular shape. According to a disclosure, a method of aligning and placing an electronic component, the electronic component having a first, top surface side and a second, bottom surface side opposite to the first surface side. The method comprising steps of illuminating the electronic component with light which transmits through the electronic component, such that at least one feature of the electronic component visible from the first surface side and at least one feature visible from the second surface side; obtaining an image of the electronic component containing image data of the at least one feature present visible from the first surface side and at least one feature visible from the second surface side; calculating of a correction value wherein the correction value is indicative of a position of the second surface side of the electronic component with respect to the first surface side of the electronic component; transferring the electronic component to an assembling station; calculating of a position of an adjusted placing area of the electronic component by adjusting a placing area, which is an area within the assembling station where the second side of the electronic component must by placed, with the correction value; placing the semiconductor component by obtaining an image containing image data of the first surface side of the electronic component and an assembly device structured to place the electronic component, such that the first surface side of the electronic component is located within the adjusted designated area.