Electronic Component Array Tape Peel Strength Control

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

In electronic component array manufacturing, the high peel strength of the leader portion of the base tape leads to errors when the cover tape is peeled off, causing the upper layer of the base tape to be accidentally removed, necessitating frequent reel replacements.

Innovation Solution

The electronic component array incorporates a base tape with a multilayer structure and a cover tape, featuring a first bonding portion with a higher peel strength and a second bonding portion with a lower peel strength, allowing for controlled peeling without removing the upper layer, achieved through specific heat treatment and bonding processes.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the base tape is made with high peel strength to maintain stable adhesion, then the cover tape remains firmly attached, but the upper layer portion of the base tape is accidentally peeled off during cover tape removal

Engineering Contradiction:

Improveadhesion stabilityVSAvoidpeeling-off of upper layer portion

Core Design Contradiction:

ReliabilityVSObject-generated harmful factors

Solution Approach 1:

The bonding between cover tape and base tape is segmented into two distinct bonding portions with different peel strengths. The first bonding portion (with electronic components) has high peel strength for stable adhesion, while the second bonding portion (without electronic components) has low peel strength to allow clean separation. This segmentation prevents accidental peeling of the upper layer portion while maintaining reliable attachment where needed.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different regions of the bonding interface are given different properties: the first bonding portion maintains high adhesion strength to ensure the cover tape stays attached during handling and storage, while the second bonding portion is designed with low adhesion strength to enable clean separation during reel replacement. This local differentiation of bonding properties resolves the contradiction between stable adhesion and easy separation.

Inventive Principle:

Principle #3Local quality

2Ease of operation

If the leader portion is located on the outermost circumference for easy identification, then it is easily accessible for peeling operations, but it is more influenced by external environment and handling stress causing increased peel strength over time

Engineering Contradiction:

Improveaccessibility for peelingVSAvoidpeel strength stability

Core Design Contradiction:

Ease of operationVSReliability

Solution Approach 1:

The second bonding portion is pre-designed with inherently low peel strength during the manufacturing process, creating a predetermined weak bonding region. This preliminary design ensures that even when the leader portion is subjected to environmental factors and handling stress, the low peel strength of the second bonding portion prevents excessive peel strength development that could cause upper layer peeling.

Inventive Principle:

Principle #10Preliminary action

3Productivity

If the cover tape is peeled off at the leader portion for efficient reel replacement, then the peeling operation is quick and easy, but the entire upper layer portion of the base tape may be peeled off causing mounting machine errors

Engineering Contradiction:

Improvereel replacement efficiencyVSAvoidmounting machine operation

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

The harmful effect of high peel strength causing upper layer peeling is extracted and isolated to the second bonding portion, which is specifically designed with low peel strength. This allows the peeling operation to be performed at the leader portion for efficient reel replacement while the low peel strength of the second bonding portion prevents the entire upper layer from being accidentally removed, thus maintaining mounting machine operation reliability.

Inventive Principle:

Principle #2Taking out (Extraction)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution significantly reduces the likelihood of peeling off the upper layer portion of the base tape during cover tape removal, minimizing errors and extending the lifespan of the reel by maintaining stable adhesion and reducing fuzz-related issues.

Implementation Method 1

achieved through specific heat treatment and bonding processes

Methodology Applied

Scientific EffectHeat treatment: Heat Treatment

Data Source

PatentUS11708204B2Electronic component array and method of manufacturing electronic component array

Publication Date: 2023.07.25 MURATA MFG CO LTD

AI summary

An electronic component array includes a base tape including paper and having approximately elongated and substantially planar shape, the base tape being provided with a plurality of accommodation recesses provided in a longitudinal direction of the base tape; a plurality of electronic components; and a cover tape. The electronic component array includes a first bonding portion in which openings of the respective accommodation recesses are covered by the cover tape in a state where the electronic components are included in the respective accommodation recesses, and a second bonding portion in which openings of the respective accommodation recesses are covered by the cover tape in a state where the electronic components are not included in the respective accommodation recesses. A peel strength of the second bonding portion is about 10% or more and about 70% or less of a peel strength of the first bonding portion.