Electronic Component Blotting Apparatus for Uniform Paste Thickness
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Solution Overview
Problem
The existing methods for forming conductive paste layers on electronic components, such as laminated ceramic capacitors and inductors, face challenges in achieving uniform film thickness due to non-uniform application and retention of the conductive paste, leading to irregularities and inefficiencies in the blotting process.
Innovation Solution
The proposed method involves a combination of distance changing and position changing movements during the blotting process, where the electronic component is moved relative to a surface plate in a plane parallel to it, allowing for the successful scraping off of excess conductive paste while ensuring uniform film thickness, and can be applied to multiple components simultaneously, with the option of using a wet conductive paste layer for enhanced transfer efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If dip coating is used to apply conductive paste, then the application process is simple, but the film thickness cannot be made uniform
Solution Approach 1:
A conductive paste layer is pre-formed on a surface plate before the electronic component body is applied. This preliminary preparation allows the paste to be evenly distributed on the plate surface, ensuring uniform thickness when the component is pressed against it, while keeping the actual application process simple.
Solution Approach 2:
The surface plate acts as an intermediary carrier for the conductive paste. Instead of directly applying paste to the electronic component body (which causes non-uniform thickness), the paste is first applied to the surface plate, then transferred to the component through contact, ensuring uniform film thickness.
2Manufacturing precision
If a blotting process is used to remove excess paste, then uniformity can be improved, but local thickening and thread formation still occur
Solution Approach 1:
The surface plate is made movable relative to the electronic component body during the blotting process. By dynamically moving the plate in a scanning manner, excess paste is uniformly removed across the entire surface, preventing local thickening and thread formation that occur with static blotting methods.
Solution Approach 2:
The blotting process transitions from a simple contact operation to a two-dimensional scanning motion. The surface plate moves across the component surface in predetermined patterns, ensuring comprehensive and uniform removal of excess paste from all areas, including corners and edges where local thickening typically occurs.
3Manufacturing precision
If the surface plate is moved to scrape off excess paste, then uniform film thickness is achieved, but the process complexity increases
Solution Approach 1:
The surface plate serves multiple functions: it acts as a carrier for the conductive paste, a template for uniform thickness, and a scraping tool for removing excess paste. This multi-functionality eliminates the need for separate application and blotting tools, reducing overall device complexity while maintaining manufacturing precision.
Solution Approach 2:
The surface plate itself performs the blotting function through its own movement. The plate's motion across the component surface automatically scrapes off excess paste without requiring additional mechanical scraping devices, simplifying the overall system while achieving uniform film thickness.
Data Source
AI summary
An electronic component manufacturing method includes a blotting process of bringing a conductive paste applied to an end portion of each electronic component body held by a jig into contact with a surface of a surface plate. The blotting process includes simultaneous performance of a distance changing process of changing the distance between an end face of each electronic component body and the surface of the surface plate and a position changing process of changing a two-dimensional position where the end face of the electronic component body is projected on the surface of the surface plate in such a manner that the direction of the movement of two-dimensional position in parallel to the surface of the surface plate successively varies (e.g., along a circular path).