Electronic Component Bonding Inspection With Sequential Lighting
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Solution Overview
Problem
Existing methods for inspecting electronic components struggle to confirm the bonding status of each component, particularly in electronic devices, as appearance inspection methods like optical microscopes are inadequate for determining proper bonding.
Innovation Solution
A method involving electrical connection of electronic components to signal lines through switching components, followed by sequential activation of these components to determine bonding status through lighting tests, mitigating IR drop issues and improving bonding accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If appearance inspection using optical microscope is applied to observe electronic components, then the placement and shifting of components can be detected, but the bonding status of each electronic component cannot be confirmed
Solution Approach 1:
The patent replaces optical mechanical inspection with electrical testing. By applying test voltages to pixel circuits and detecting their electrical responses, the system can confirm bonding status through electrical continuity and functional performance, which is more reliable than optical appearance inspection for detecting actual bonding quality.
2Reliability
If electrical testing is applied to all electronic components simultaneously, then bonding status can be determined, but IR drop causes insufficient brightness and misjudgment
Solution Approach 1:
The patent divides the array of electronic components into multiple groups and performs electrical testing on each group sequentially rather than simultaneously. This segmentation approach limits the number of active test circuits at any one time, reducing total current draw and minimizing IR drop effects, thereby maintaining brightness accuracy for reliable bonding status determination.
Solution Approach 2:
The patent implements periodic testing by sequentially activating different groups of pixel circuits at different time intervals. Each group is tested in a periodic sequence, allowing the system to complete comprehensive bonding status determination across all components while controlling peak current demands to prevent IR drop-related measurement errors.
3Measurement precision
If sequential activation of switching components is applied to reduce IR drop, then bonding status accuracy improves, but inspection time increases
Solution Approach 1:
The patent segments the array into multiple groups that can be tested in parallel sequences. By organizing the sequential activation into efficient groups and utilizing the parallel structure of the array, the inspection process maintains high accuracy through controlled sequential testing while minimizing total inspection time through optimized group scheduling.
Data Source
AI summary
A method for inspecting electronic components and an electronic device are provided. The electronic device includes electronic elements, signal lines, an inspection structure, a substrate and a first driving element electrically connected to the signal lines. The signal lines include a first and a second signal lines. The electronic components include a first group of electronic components electrically connected to the first signal line and a second group of electronic components electrically connected to the second signal line. The first signal line has a first portion overlapping a first inspection region and a second portion overlapping the first driving element. The second signal line has a third portion overlapping a second inspection region and a fourth portion overlapping the first driving element. A distance between the second portion and the fourth portion is smaller than a distance between the first portion and the third portion.