Electronic Component Bracket Encapsulation for Covered Connecting Ribs

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Solution Overview

Problem

The existing manufacturing process of electronic component brackets results in exposed connecting ribs, making them susceptible to invasion by light-sensitive or harmful substances, leading to discoloration and deterioration of the plating and encapsulation material.

Innovation Solution

The electronic component bracket design includes a metal sheet assembly with internally filled resin layers and protrusions covering the connecting rib sections, forming a tubular structure with a top resin layer that encapsulates the bracket, preventing exposure of the connecting ribs and enhancing reliability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If the connecting ribs are removed to disconnect adjacent array units, then the manufacturing efficiency is improved and the structure is simplified, but the connecting rib sections become exposed and susceptible to harmful substance invasion

Engineering Contradiction:
Improvemanufacturing efficiencyVSAvoidprotection against harmful substance invasion
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

The protrusion structure is nested within the top resin layer, creating a hierarchical structure where the protrusion covers the connecting rib section while being integrated into the resin layer. This nested design allows the connecting rib sections to be protected without requiring separate external covering components, thus maintaining manufacturing efficiency while improving reliability.

Inventive Principle:
Principle #7Nested doll (Nesting)

Solution Approach 2:

The solution transitions from a two-dimensional planar structure to a three-dimensional structure by adding protrusions that extend vertically from the top resin layer. This dimensional change allows the connecting rib sections to be covered from above, preventing harmful substance invasion while maintaining the simplified structure achieved by removing the connecting ribs.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Device complexity

If the connecting ribs are completely removed to obtain independent array units, then the device complexity is reduced, but gaps are created that allow light-sensitive or harmful substances to invade

Engineering Contradiction:
Improvestructure complexityVSAvoidharmful substance invasion
Core Design Contradiction:
Device complexityVSObject-affected harmful factors

Solution Approach 1:

Instead of uniformly covering all surfaces or adding complex protective structures throughout, the solution applies local quality by creating protrusions only at specific locations where connecting rib sections are exposed. This localized approach provides protection against harmful substance invasion only where needed, maintaining overall structural simplicity while addressing the specific vulnerability of exposed connecting rib sections.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The protrusions act as an intermediary structure between the top resin layer and the connecting rib sections. Rather than directly exposing the connecting rib sections or adding a completely separate protective layer, the protrusions serve as a mediating element that provides protection while being integrally connected to the existing resin layer structure.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Reliability

If the top resin layer is made to fully cover the integrated unit, then the protection against harmful substances is improved, but the manufacturing complexity and material usage increase

Engineering Contradiction:
Improveprotection against harmful substance invasionVSAvoidstructure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The top resin layer is segmented into two functional parts: a flat base layer that provides general coverage and protrusions that provide targeted protection for connecting rib sections. This segmentation allows the resin layer to fulfill multiple protective functions with a unified structure, improving reliability without requiring multiple separate components or excessive material usage.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The top resin layer is designed with multi-functionality, serving both as a general protective enclosure and as a structure that provides targeted coverage for exposed connecting rib sections through its protrusions. This universal design allows a single component to fulfill multiple protective roles, improving reliability while avoiding the need for additional specialized protective elements.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design effectively prevents the invasion of light-sensitive or harmful substances, improving the reliability and integrity of the electronic component bracket by ensuring the side surfaces are fully covered.

Implementation Method 1

the internally filled resin layer fills a gap between the positive metal sheet and the negative metal sheet

Methodology Applied
Scientific EffectPhysical containment: Physical Containment

Implementation Method 2

the protrusions cover the connecting rib sections

Methodology Applied
Scientific EffectPhysical barrier: Physical Containment

Implementation Method 3

the tubular structure covers an outer edge of a top surface of the integrated unit

Methodology Applied
Scientific EffectEncapsulation: Physical Containment

Data Source

PatentUS20250391749A1Electronic component bracket, manufacturing process thereof, and encapsulated product
Publication Date: 2025.12.25 FUJIAN TIANDIAN OPTOELECTRONICS CO LTD
  • US20250391749A1 patent drawing
  • US20250391749A1 patent drawing

AI summary

Provided are an electronic component bracket, a manufacturing process therefor, and an encapsulated product. The electronic component bracket includes a metal sheet assembly, an internally filled resin layer, a bottom resin layer, and a top resin layer. The metal sheet assembly includes a positive metal sheet and a negative metal sheet, and connecting rib sections are disposed on a side surface of each of the positive metal sheet and the negative metal sheet. The top resin layer includes a tubular structure and protrusions that are integrally connected, and the protrusions are arranged at an outer edge of a bottom surface of the tubular structure. The protrusions cover the connecting rib sections. A top surface of the bottom resin layer is provided with accommodation grooves in fit with the protrusions.