Embedded Component Carrier Wiring via Homogeneous Ablation Surface
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Solution Overview
Problem
The increasing miniaturization and complexity of electronic components on component carriers, such as printed circuit boards, make it challenging to contact embedded and surface-mounted components reliably, while maintaining mechanical robustness, especially under harsh conditions.
Innovation Solution
A component carrier with an electrically insulating core and embedded electronic components, featuring a coupling structure with conductive through-connections and a surface with homogeneous ablation properties, allowing direct electrical contact and flexible wiring design through ablation processes, eliminating the need for redistribution layers and enabling ultrafine line interconnections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If electronic components are miniaturized and densely packed to increase functionality, then the number of contacts and product functionalities increase, but the spacing between contacts decreases making contacting more challenging
Solution Approach 1:
The patent transitions from planar surface mounting to three-dimensional embedding of electronic components within the core. This dimensional change allows contacts to be arranged in multiple layers and directions, increasing functionality without reducing contact spacing on any single plane. The embedding approach enables vertical stacking and multi-level interconnections.
Solution Approach 2:
The patent embeds electronic components directly within the core material, nesting them inside the component carrier structure rather than mounting them on the surface. This nesting approach maximizes space utilization and allows for higher density packaging while maintaining adequate contact spacing through three-dimensional arrangement.
2Adaptability or versatility
If the number of electronic components increases on the component carrier, then product functionalities increase, but the complexity of contacting these components increases
Solution Approach 1:
The patent employs a universal embedding approach where multiple electronic components are integrated into the core using the same manufacturing process and coupling structure design. This multi-functional capability allows the component carrier to handle various types of components (semiconductor chips, passive components, sensors) uniformly, reducing contacting complexity despite increasing component diversity and quantity.
Solution Approach 2:
The patent divides the component carrier into multiple independent coupling structures, each capable of contacting individual electronic components or groups of components. This segmentation allows for modular assembly and independent processing of different component regions, reducing the overall complexity of contacting numerous components.
3Ease of manufacture
If conventional manufacturing methods are used with non-homogeneous surfaces, then existing processes can be maintained, but ablation properties are non-uniform requiring redistribution layers
Solution Approach 1:
The patent employs a coupling structure with a homogeneous exterior surface portion that exhibits uniform ablation properties. This homogeneity eliminates the need for redistribution layers by providing consistent material removal characteristics during laser ablation or other removal processes, enabling precise patterning of wiring structures directly on the coupling structure surface.
Solution Approach 2:
The patent extracts the problematic non-homogeneous surface layer from the coupling structure design, creating a dedicated homogeneous exterior surface portion. This extracted homogeneous layer is specifically engineered for uniform ablation, separating the structural functions from the surface processing requirements.
4Reliability
If redistribution layers are used to achieve wiring connections, then electrical connections can be established, but the device complexity and number of manufacturing steps increase
Solution Approach 1:
The patent eliminates the redistribution layer from the wiring structure by directly patterning the wiring onto the homogeneous exterior surface portion of the coupling structure. This extraction of the intermediate redistribution layer simplifies the device architecture while maintaining reliable electrical connections between embedded components and surface wiring.
Solution Approach 2:
The patent performs preliminary patterning of the wiring structure directly on the coupling structure surface before final assembly and connection steps. This preliminary action eliminates the need for subsequent redistribution layer deposition and patterning, reducing manufacturing steps and device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution provides a simple, reliable, and robust method for contacting embedded electronic components, enabling efficient ultrafine line wiring and interconnections without redistribution layers, suitable for high-density applications and harsh environments.
Implementation Method 1
at least an exterior surface portion of the coupling structure has homogeneous ablation properties and is patterned so as to have surface recesses
Data Source
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AI summary
A component carrier (100) for carrying electronic components (104), wherein the component carrier (100) comprises an at least partially electrically insulating core (102), at least one electronic component (104) embedded in the core (102), and a coupling structure (106, 202) with at least one electrically conductive through-connection (108) extending at least partially therethrough and having a component contacting end (112) and a wiring contacting end (114), wherein the at least one electronic component (104) is electrically contacted directly to the component contacting end (112), wherein at least an exterior surface portion of the coupling structure (106, 202) has homogeneous ablation properties and is patterned so as to have surface recesses filled with an electrically conductive wiring structure (110), and wherein the wiring contacting end (114) is electrically contacted directly to the wiring structure (110).