Component Carrier Aligned Through Holes Fiducial Detection
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Solution Overview
Problem
The challenge in evaluating the quality of component carriers, particularly during manufacturing, is the difficulty in reliably detecting fiducial structures due to cross-talking between reflected electromagnetic radiation from electrically conductive and insulating layers, which can lead to inaccurate imaging and quality assessment.
Innovation Solution
A component carrier structure with aligned first and second through holes in electrically conductive layers, surrounded by an insulating material, reduces cross-talking by minimizing skew reflected radiation, allowing for more accurate imaging and quality evaluation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If electromagnetic radiation is directed towards the component carrier to detect fiducial structures, then quality evaluation can be performed, but cross-talking between reflected radiation from conductive and insulating layers causes unreliable detection
Solution Approach 1:
The patent extracts the harmful reflected radiation from the second electrically conductive layer structure by removing or not forming this layer, thereby eliminating the cross-talking that interferes with fiducial detection while preserving the necessary electrical functionality through the first conductive layer structure
Solution Approach 2:
The electrically insulating layer structure serves as an intermediary between the first electrically conductive layer structure and the substrate, enabling electromagnetic radiation to pass through to reach the fiducial structure while preventing harmful reflections from underlying layers
2Adaptability or versatility
If multiple electrically conductive layer structures are stacked to provide electrical functionality, then device performance is improved, but reflected radiation from multiple layers causes cross-talking and reduces imaging clarity
Solution Approach 1:
The patent removes the second electrically conductive layer structure that causes harmful reflections, retaining only the first electrically conductive layer structure necessary for electrical functionality, thereby eliminating cross-talking while maintaining essential device performance
Solution Approach 2:
The patent segments the electrical functionality into a single optimized conductive layer structure with integrated fiducial features, rather than using multiple stacked conductive layers that create interference problems
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The alignment of through holes in the component carrier's conductive layers enhances the reliability of quality evaluation by reducing cross-talking and improving the identification of fiducial structures, leading to more accurate and efficient assessment of component carrier quality.
Implementation Method 1
The incident electromagnetic radiation beam 202 is partly reflected at an outer surface 918 of the electrically insulating layer structure 908 as reflected electromagnetic radiation beam 204
Implementation Method 2
Due to different refraction indexes and due to the insulating material of the electrically insulating layer structure 908 having a reflectivity similar to the first electrically conductive layer structure 902
Data Source
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AI summary
Component carrier (100) comprising a stack, having: a first electrically conductive layer structure (102) with a first through hole (110); a second electrically conductive layer (104) structure with a second through hole (112); and at least one electrically insulating layer structure (106), comprising a first insulating material (114), arranged between the first electrically conductive layer structure (102) and the second electrically conductive layer structure (104); wherein the first through hole (110) and the second through hole (112) are aligned in the stacking direction (z) of the stack.