Component Carrier Bridge Structure for Crack Prevention
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Solution Overview
Problem
Component carriers with thin electrically insulating layers face reliability issues due to the formation of cracks and voids in through holes, especially when subjected to temperature changes, which affects both mechanical and electrical reliability.
Innovation Solution
A component carrier design featuring a through hole with a vertical thickness of the electrically insulating layer not exceeding 200 μm and an electrically conductive bridge structure with a narrowest vertical thickness of at least 20 μm, ensuring reliable electrical connectivity and mechanical robustness by preventing crack formation and maintaining conductive filling integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the vertical thickness of the electrically insulating layer structure is reduced to enable miniaturization, then the component carrier size is reduced, but the reliability deteriorates due to crack formation and voids in through holes
Solution Approach 1:
The patent applies local quality by making the bridge structure substantially homogeneous in vertical thickness, ensuring uniform material distribution and consistent electrical properties throughout the conductive path. This local uniformity prevents weak points that could lead to cracks or voids, thereby maintaining high reliability in the miniaturized component carrier.
Solution Approach 2:
The patent changes the critical parameter of bridge structure vertical thickness to be at least 20 μm, which is sufficiently thick to prevent crack formation and voids while allowing the overall component carrier to be miniaturized. This parameter optimization resolves the contradiction between small size and high reliability.
2Reliability
If the vertical thickness of the bridge structure is increased to prevent cracks and ensure electrical reliability, then the electrical path integrity is improved, but the manufacturing complexity increases
Solution Approach 1:
The patent forms the bridge structure with sufficient vertical thickness (at least 20 μm) during the initial through-hole formation process, before subsequent assembly and testing steps. This preliminary action ensures that the electrical path integrity is built-in from the start, avoiding the need for complex post-processing or repair operations.
Solution Approach 2:
By setting the bridge structure vertical thickness to at least 20 μm, the patent establishes a clear manufacturing parameter that simplifies process control and quality inspection, reducing manufacturing complexity while ensuring reliable electrical connectivity.
3Productivity
If miniaturization is pursued to reduce component carrier dimensions, then the productivity and density are improved, but the thermal management capability deteriorates due to reduced heat dissipation capacity
Solution Approach 1:
The patent employs a composite structure combining the electrically insulating layer structure with a substantially homogeneous bridge structure made of conductive material. This composite design allows the miniaturized component carrier to maintain efficient thermal pathways through the bridge structure while achieving high component density, thus resolving the contradiction between productivity and thermal management.
Data Source
AI summary
A component carrier includes an electrically insulating layer structure having a first main surface and a second main surface with a through hole extending through the electrically insulating layer structure between the first main surface and the second main surface. An electrically conductive bridge structure connects opposing sidewalls of the electrically insulating layer structure delimiting the through hole. A vertical thickness of the electrically insulating layer structure is not more than 200 μm and a narrowest vertical thickness of the bridge structure is at least 20 μm.