Component Carrier Cavity Fill for Reliable Layer Connections
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Solution Overview
Problem
Existing component carriers face challenges in maintaining high-quality electrical connections due to incomplete, insufficient, or faulty contacting, which can lead to signal loss, distortion, and mechanical failures, especially with increasing miniaturization and package density.
Innovation Solution
A component carrier design featuring a cavity in the insulating layer structure with a conductive paste that deforms to form a stable, high-quality electrical connection by filling the cavity with an amount exceeding its initial volume, ensuring reliable connections between conductive layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional electrical connection methods are used in component carriers, then manufacturing process is simple, but connection quality and reliability deteriorate due to incomplete or faulty contacting
Solution Approach 1:
The cavity is pre-formed in the insulating layer structure before the conductive paste is applied. This preliminary structural preparation ensures that the conductive paste has a defined space to deform into, guaranteeing complete contacting with both conductive layer structures and preventing connection failures.
Solution Approach 2:
The conductive paste undergoes parameter changes during the lamination process, specifically volume expansion and shape deformation. The paste is applied in a semi-liquid state with volume slightly larger than the cavity, then undergoes compression and reshaping during lamination to perfectly fill the cavity and establish reliable electrical connections.
2Manufacturing precision
If conductive paste is applied to fill cavity, then electrical connection quality improves, but manufacturing precision requirements increase
Solution Approach 1:
The conductive paste is applied with a volume slightly exceeding the cavity volume (e.g., 10-50% excess). During lamination, the paste undergoes compression and shape change, transitioning from a loose semi-liquid state to a dense filled state. This parameter change allows the paste to adapt to the cavity geometry without requiring extremely tight manufacturing tolerances.
Solution Approach 2:
The conductive paste is designed to be deformable rather than rigid. During the lamination process, the paste dynamically adjusts its shape and volume to perfectly conform to the cavity geometry, ensuring complete contacting with the conductive layer structures while accommodating normal manufacturing variations.
3Strength
If cavity is filled with conductive paste exceeding initial volume, then mechanical stability and electrical performance improve, but material utilization increases
Solution Approach 1:
The conductive paste undergoes significant density increase during lamination. Applied in a semi-liquid state with higher volume, the paste is compressed and sintered during the lamination process, reducing its volume while increasing its density and mechanical strength. This parameter change ensures sufficient paste quantity for reliable connections without excessive material waste.
Solution Approach 2:
The conductive paste is formulated as a composite material containing conductive particles (such as metal powders or fibers) embedded in a binder matrix. This composite structure provides both electrical conductivity and mechanical stability, allowing the paste to achieve reliable electrical connections while maintaining structural integrity during the lamination process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces the risk of defective connections, enhances mechanical stability, and improves electrical performance by providing a stable structure that is less sensitive to thermal stress and shrinkage, resulting in a lower scrap rate and increased reliability.
Implementation Method 1
a conductive paste which is deformable and which, when the stack is formed, deforms to form an electrically conductive element having a shape adapted to the shape of the cavity
Implementation Method 2
when the stack is formed, deforms to form an electrically conductive element
Data Source
Figure 1~3
Figure 4~5b
Figure 6~7
AI summary
The present invention relates to a component carrier (100), a method for manufacturing thereof, and to a component carrier assembly, wherein the component carrier (100) comprises a stack with a plurality of electrically conductive layer structures (10, 20) and at least one electrically insulating layer structure (30), wherein the insulating layer structure (30) is stacked in between two electrically conductive layer structures (10, 20), wherein the two electrically conductive layer structures (10, 20) are electrically connected one to each other by an electrically conductive element (40) comprising an electrically conductive paste (42) provided in a cavity (41) being located in between said two electrically conductive layer structures (10, 20), wherein said cavity (41) is in lateral direction delimited by a lateral wall of the electrically insulating layer structure (30), said lateral wall having two opposed portions with different inclinations relative to a contacting plane between the electrically insulating layer structure (30) and one of said two electrically conductive layer structures (10, 20) and with respect to a thickness direction of the stack.