Component Carrier Cavity Masking for Fine-Pitch Embedding
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Solution Overview
Problem
Conventional methods face challenges in embedding fine-pitch components in cavities of component carriers due to difficulties in attaching and contacting these components effectively, which hinders the miniaturization of electronic systems.
Innovation Solution
A method involving a component carrier with a stack structure that includes a poorly adhesive structure, which is partially removed to expose the cavity bottom for applying a finishing structure, allowing for a smaller lateral extension and enabling efficient embedding of fine-pitch components by using the poorly adhesive structure as a mask layer for selective material application.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If conventional methods are used to embed fine-pitch components in a cavity, then component miniaturization is achieved, but the manufacturing process becomes difficult and complex
Solution Approach 1:
A mask layer is applied to the cavity bottom before the component is placed. This preliminary action defines the contact structure area in advance, making the subsequent embedding process simpler and more precise. The mask layer serves as a pre-prepared template that guides the formation of electrical contacts, eliminating the need for complex post-processing steps.
Solution Approach 2:
The mask layer is selectively removed from specific areas where electrical contacts are needed. This extraction approach allows the cavity bottom to be exposed only in the necessary regions, creating the contact structures without requiring complex patterning processes. The unnecessary portions of the mask layer are removed, leaving only the functional contact areas.
2Quantity of substance
If the finishing structure has the same lateral extension as the contact structure, then complete coverage is achieved, but material usage increases and fine-pitch components cannot be accommodated
Solution Approach 1:
The finishing structure is applied with a lateral extension that is smaller than the contact structure, creating a localized configuration. This local quality approach means the finishing structure covers only the essential contact areas rather than the entire contact structure. This selective coverage reduces material usage while maintaining the precision needed for fine-pitch components, as the finishing structure is precisely positioned where electrical contact is required.
3Reliability
If multiple process steps are used to apply finishing structures in cavities, then complete finishing is achieved, but process complexity increases
Solution Approach 1:
The mask layer serves multiple functions simultaneously: it acts as a protective layer during component placement, defines the contact structure area, and serves as a template for finishing structure application. By merging these functions into a single layer and process sequence, the number of separate process steps is reduced while maintaining the quality and reliability of the finishing structure.
Solution Approach 2:
The mask layer is a multi-functional element that performs several roles in the embedding process. It provides mechanical support during component handling, defines the electrical contact patterns, and serves as a base for the finishing structure. This multi-functionality eliminates the need for separate structures or processes for each function, simplifying the overall manufacturing process while ensuring reliable finishing.
Data Source
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AI summary
A method of manufacturing a component carrier (100) comprises: (i) embedding a poorly adhesive structure (110) in a stack (101), wherein the stack (101) comprises at least one electrically conductive layer structure (102) and/or at least one electrically insulating layer structure (103); (ii) forming a cavity (420) in the stack (101) by removing a stack piece, wherein the stack piece is in part delimited by the poorly adhesive structure (110); and (iii) selectively exposing a bottom (421) of the cavity (420) by partially removing the poorly adhesive structure (110). A corresponding component carrier (100) comprises analogous features.