Component Carrier Interconnect Structure for CTE Mismatch Compensation

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Solution Overview

Problem

Existing component carriers and packages face challenges in achieving reliable and stable connections between components and carriers, particularly under changing environmental conditions, due to mismatched coefficients of thermal expansion (CTE) and geometrical inaccuracies.

Innovation Solution

The use of a heterogeneous conductive structure for the connecting element, which is designed to permanently compensate for relative movements between electrically conductive surfaces and connecting surfaces, ensuring alignment and expansion mismatch compensation along the x-y and z directions.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional connecting elements are used to connect components to the carrier, then the assembly process is simple, but the connection reliability deteriorates under changing temperature conditions due to CTE mismatch and geometrical inaccuracies

Engineering Contradiction:
Improveconnection reliabilityVSAvoidconnecting element structure
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The connecting element employs a composite structure comprising a first material and a second material with different coefficients of thermal expansion. This composite construction enables the connecting element to accommodate CTE mismatch between the component and carrier, compensating for thermal expansion differences while maintaining connection reliability under varying temperature conditions.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The invention utilizes materials with specifically selected physical parameters, particularly different coefficients of thermal expansion, to create a connecting element that can adapt to thermal variations. By changing the material parameters of the composite structure, the connecting element achieves compensation for both CTE mismatch and geometrical inaccuracies, ensuring stable electrical connection across temperature ranges.

Inventive Principle:
Principle #35Parameter changes

2Reliability

If rigid connecting elements are used to ensure stable electrical connection, then electrical conductivity is maintained, but mechanical stress increases due to CTE mismatch and alignment tolerances

Engineering Contradiction:
Improveelectrical connection stabilityVSAvoidmechanical stress on connection
Core Design Contradiction:
ReliabilityVSStress or pressure

Solution Approach 1:

The composite material structure with different physical parameters (CTE values) enables the connecting element to flexibly accommodate thermal expansion differences. This parameter differentiation allows the connecting element to maintain electrical conductivity while reducing mechanical stress transmission to the component and carrier interfaces.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The connecting element acts as an intermediary component between the component and carrier, mediating the mechanical stress caused by CTE mismatch. The composite structure of the connecting element absorbs and distributes thermal stresses, preventing direct stress transmission that would otherwise occur in rigid single-material connections.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Manufacturing precision

If precise alignment features are implemented to compensate for geometrical inaccuracies, then connection precision improves, but manufacturing complexity and cost increase

Engineering Contradiction:
Improvealignment precisionVSAvoidmanufacturing simplicity
Core Design Contradiction:
Manufacturing precisionVSEase of manufacture

Solution Approach 1:

Instead of relying on precise mechanical alignment features, the invention changes the material parameters of the connecting element to inherently compensate for geometrical inaccuracies. The composite material structure with differentiated CTE values provides self-alignment and tolerance compensation, eliminating the need for complex precision machining or alignment mechanisms.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The connecting element performs self-alignment and self-compensation of geometrical inaccuracies through its composite material properties. The differential thermal expansion characteristics enable the connecting element to automatically adjust to misalignments and tolerances during thermal cycling, without requiring external alignment features or complex manufacturing processes.

Inventive Principle:
Principle #25Self-service

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution provides a reliable and stable connection that withstands environmental changes, reduces mechanical stress, and compensates for geometrical inaccuracies, thereby enhancing the quality and reliability of component connections.

Implementation Method 1

the connecting element is made of a heterogeneous conductive structure that is arranged to permanently compensate for a relative movement of said electrically conductive surface of the component and said connecting surface of the external component with the component carrier

Methodology Applied
Scientific EffectElastic deformation: Elasticity

Data Source

PatentEP4517820A1Component carrier
Publication Date: 2025.03.05 AT & S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AG
  • EP4517820A1 patent drawingFigure 1~3
  • EP4517820A1 patent drawingFigure 4~6
  • EP4517820A1 patent drawingFigure 7~9

AI summary

The invention concerns a component carrier, wherein the component carrier comprises: a stack (10) comprising a plurality of electrically conductive layer structures (11) and at least one electrically insulating layer structure (12), a component (13) provided in and/or on the stack (10), said component (13) comprising at least one electrically conductive surface (14) connected to an electrically conductive connecting element (15), said connecting element (15) extending from said electrically conductive surface (14) away from the stack (10) and configured to be connected to at least one external component (16, 17) to be mounted on the component carrier when at least one connecting surface (18, 19) provided in/on the external component (16, 17) is faced to the electrically conductive surface (14) of the component (13), wherein the connecting element (15) is made of a heterogeneous conductive structure (23, 29, 31, 33) that is arranged to permanently compensate for a relative movement between said electrically conductive surface (14) of the component (13) and said connecting surface (18, 19) of the external component (16, 17). The invention further concerns a package using such component carrier.