Sheet for component carrier comprising separate structures with filler particles having different hollow volume therein
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Solution Overview
Problem
Conventional component carriers face reliability issues in high-frequency and high-speed applications due to inadequate mechanical and electrical performance, particularly in harsh conditions, where signal integrity and transmission efficiency are compromised.
Innovation Solution
A component carrier is manufactured using a sheet comprising a stack of first and second structures with filler particles in a resin matrix, where the second structure has a larger hollow volume than the first, allowing for a low dielectric constant and improved mechanical robustness, with air-filled hollow filler particles strategically positioned near conductive layers to enhance signal integrity and withstand mechanical and chemical stress.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional materials and uniform filler particle structures are used, then manufacturing simplicity is maintained, but mechanical robustness and electrical reliability are insufficient for high-frequency applications
Solution Approach 1:
The patent applies local quality by creating two distinct structures with different filler particle characteristics: a first structure with smaller hollow volume filler particles and a second structure with larger hollow volume filler particles. Each structure is optimized for specific requirements - the first structure provides mechanical robustness while the second structure enhances electrical performance for high-frequency applications, thereby resolving the contradiction between reliability and complexity.
Solution Approach 2:
The patent employs composite materials by combining resin matrices with hollow filler particles of varying hollow volumes in different structures. This composite approach allows the component carrier to achieve both mechanical strength and low dielectric constant properties simultaneously, improving reliability without excessive complexity increase.
2Reliability
If hollow filler particles with large hollow volume are used throughout, then dielectric constant is reduced for high-frequency performance, but mechanical strength and resistance to particle breakage deteriorate
Solution Approach 1:
The patent implements local quality by spatially differentiating filler particle hollow volumes: the first structure contains filler particles with smaller hollow volume to provide mechanical strength and breakage resistance, while the second structure contains filler particles with larger hollow volume to reduce dielectric constant and improve signal integrity. This localized optimization resolves the contradiction between electrical performance and mechanical strength.
Solution Approach 2:
The patent applies segmentation by dividing the component carrier into at least two separate structures with distinct filler particle characteristics. This segmentation allows each structure to fulfill specific functions - mechanical support and electrical performance - without compromising the other, thereby resolving the contradiction between signal integrity and mechanical strength.
3Reliability
If uniform filler particle distribution is used, then manufacturing process is simplified, but high-frequency signal transmission performance is compromised
Solution Approach 1:
The patent applies segmentation by creating at least two separate structures with different filler particle distributions. The first structure and second structure are manufactured separately with optimized filler characteristics, then combined. This segmentation enables high-frequency performance optimization without requiring complete redesign of the entire manufacturing process, thus balancing performance and manufacturability.
Solution Approach 2:
The patent implements local quality by applying different filler particle characteristics to different structures: the first structure uses filler particles optimized for mechanical properties, while the second structure uses filler particles optimized for dielectric performance. This localized differentiation achieves high-frequency transmission performance while maintaining relatively simple manufacturing processes for each individual structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a component carrier with improved mechanical reliability and low signal loss, suitable for high-frequency applications above 1 GHz, ensuring high-speed data transmission with reduced attenuation and distortion, while preventing filler particle breakage during manufacturing.
Implementation Method 1
By providing dielectric material with low Dk and/or low Df property, faster speed and/or higher frequency as well as a better signal integrity may be achieved by reducing intensity drops and impedance of electrical transmission
Data Source
AI summary
A sheet for manufacturing a component carrier includes a first structure having first filler particles in a resin matrix, and a second structure stacked with the first structure and having second filler particles in a resin matrix, wherein a hollow volume in a respective one of the second filler particles is larger than in a respective one of the first filler particles.