Component Carrier Surface Protection With Shared ENEPIG Layers
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing methods for providing surface protection for exposed electrically conductive layer structures on component carriers, such as printed circuit boards, are costly, cumbersome, and prone to corrosion, with potential impacts on soldering performance and electrical transmission quality due to the need for multiple protective layers and the absence of a palladium layer between nickel and gold.
Innovation Solution
A component carrier design and manufacturing method that uses a common non-exposed layer structure, such as ENEPIG, combined with a different exposed layer structure, like plated gold, to provide robust protection for both conductor areas, reducing the need for multiple protective layers and minimizing corrosion risks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple different protective layers are applied to different exposed conductor areas, then surface protection and soldering performance are improved, but manufacturing complexity and cost increase
Solution Approach 1:
The patent applies different protective layer structures to different exposed conductor areas (first exposed conductor area gets first protective layer structure, second exposed conductor area gets second protective layer structure). This allows each area to have optimized protection and soldering properties specific to its functional requirements, while the common non-exposed layer structure provides baseline protection across all areas.
2Reliability
If multiple protective layers are applied to different exposed conductor areas, then surface protection is improved, but manufacturing cost increases
Solution Approach 1:
The patent merges the common protective functions into a single non-exposed layer structure that serves both exposed conductor areas, while only the exposed areas receive additional different protective layers. This reduces the total number of manufacturing steps compared to applying multiple protective layers to all areas, thereby reducing manufacturing cost while maintaining differentiated protection where needed.
3Ease of manufacture
If exposed electrically conductive layer structures are left unprotected, then manufacturing simplicity is maintained, but corrosion resistance deteriorates
Solution Approach 1:
The patent applies a common non-exposed layer structure to all exposed conductor areas before subsequent selective protective layer application. This preliminary protective layer prevents corrosion during manufacturing and storage, and the selective additional layers provide enhanced protection and soldering properties. This approach maintains manufacturing simplicity by using a systematic sequential process while ensuring comprehensive corrosion resistance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly shortens the manufacturing process, saves costs, and enhances the reliability of the component carrier by preventing corrosion while maintaining excellent soldering performance and electrical conductivity.
Implementation Method 1
Electroless Nickel Immersion Gold (ENIG)
Implementation Method 2
plated gold
Data Source
Figure 1~1C
Figure 2~2B
Figure 3A~3C
AI summary
The invention relates to a component carrier (100) and a method of manufacturing the component carrier (100). The component carrier (100) comprises : i) a first exposed conductor area (110), comprising a first protective layer structure (111) on a first electrically conductive layer structure (112); and ii) a second exposed conductor area (120), comprising a second protective layer structure (121) on a second electrically conductive layer structure (122). The first protective layer structure (111) and the second protective layer structure (121) comprise: a) a common non-exposed layer structure (130); and b) different exposed layer structures (133, 140).