Component Carrier Opening Partial Filling by Cure-State Control
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Solution Overview
Problem
Existing methods for partially filling component carrier openings, such as through holes or cavities, are unreliable and lack control over resin filling depth and amount, leading to potential malfunctioning circuit boards and poor interconnections.
Innovation Solution
A method involving a pre-cured curable dielectric element with a controlled cure state is used to partially fill component carrier openings, ensuring precise filling depth and amount by controlling the flow of the dielectric material, which is then laminated with a second uncured dielectric element to form a robust interconnection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If non-conductive paste is used to partially fill openings, then plug-in insertion is enabled, but resin filling depth and amount cannot be controlled reliably
Solution Approach 1:
A first curable dielectric element is placed on the component carrier before the lamination process, positioning it so that it will flow into the openings during subsequent lamination. This preliminary placement enables controlled partial filling before the actual bonding occurs.
Solution Approach 2:
The cure state of the first curable dielectric element is specifically controlled to be different from the second curable dielectric element. The first element is kept in a less cured state with lower viscosity to enable flow into openings, while the second element is more cured to provide structural stability.
2Quantity of substance
If non-conductive paste is used for partial filling, then openings are partially filled, but mechanical stability is insufficient to stop resin flow during lamination
Solution Approach 1:
The cure state (viscosity) of the first curable dielectric element is specifically controlled to be lower than that of the second element. This parameter differentiation allows the first element to flow into openings during lamination while the more cured second element provides the mechanical stability needed to control the overall filling process.
3Ease of manufacture
If low-quality partial hole filling is performed, then openings are filled, but circuit board malfunction and poor interconnection occur
Solution Approach 1:
The invention controls the cure state of the first curable dielectric element to be specifically less cured than the second element. This creates a viscosity difference that enables reliable flow into openings during lamination, ensuring proper filling without causing malfunctions or poor interconnections.
Solution Approach 2:
The first curable dielectric element is pre-positioned on the component carrier before lamination, ensuring that it will flow into the openings at the correct location and amount during the bonding process, thereby guaranteeing reliable circuit board functionality.
4Productivity
If complete lamination is performed without controlled partial filling, then openings are fully filled, but precise filling depth cannot be achieved
Solution Approach 1:
The invention creates a viscosity gradient by controlling the cure states of two different curable dielectric elements. The first element maintains lower viscosity to flow into openings during standard lamination, while the second element's higher viscosity prevents over-filling, achieving precise depth control through normal lamination processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables reliable and robust partial filling of component carrier openings, allowing for efficient plug-in connections and reduced risk of resin overflow during lamination, thereby enhancing mechanical stability and electrical reliability.
Implementation Method 1
A first curable dielectric element is arranged on a component carrier, in particular on a main surface of a layer stack. A part of the first curable dielectric element extends into an opening of the layer stack. The first curable dielectric element has a first predetermined cure state (fulfilling a predetermined cure state criterion), in order to enable a controlled flow of curable dielectric material from the first curable dielectric element into the opening.
Implementation Method 2
The first curable dielectric element has a first predetermined cure state (fulfilling a predetermined cure state criterion). The cure state of the first curable dielectric element is different from a cure state of a second curable dielectric element, in particular the first curable dielectric element is less cured than the second curable dielectric element.
Data Source
Figure 1~2d
Figure 3a~6
Figure 7~9c
AI summary
It is described a component carrier (100) comprising: i) a layer stack (101) with at least one electrically insulating layer structure (102) and/or at least one electrically conductive layer structure (104), ii) at least one opening (110) in the layer stack (101), iii) a first curable dielectric element (120) arranged at least partially on the opening (110), and iv) a second curable dielectric element (130) arranged adjacent to the first curable dielectric element (120), so that there is an interface region (150) in between. The cure state of the first dielectric element (120) is more cured than the cure state of the second dielectric element (130) during component carrier (100) manufacturing, and this difference in the cure state is determinable at the interface region (150) as an interface pattern (155).