Component Carrier Structure for Fine-Line Patterning Without Cracking
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Solution Overview
Problem
Existing component carriers face challenges in providing fine-line patterning and high stability while maintaining mechanical robustness and electrical reliability, particularly due to limitations in insulation layer formation and stiffness, which can lead to cracking under thermal impact.
Innovation Solution
A component carrier architecture featuring an inorganic carrier structure, reinforced resin layer with glass fibers, and an ultra-thin insulation film enables direct formation of a fine-line patterned conductive layer, enhancing adhesion and stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a conventional insulation layer (ABF) is used with semi-additive process, then manufacturing is easier, but fine-line patterning capability is limited
Solution Approach 1:
The patent changes the key parameter of insulation layer thickness from conventional (e.g., 10-20 μm) to ultra-thin (1-5 μm). This parameter change enables fine-line patterning with line widths of 10 μm or less while maintaining manufacturing feasibility through optimized lamination processes and controlled material selection
Solution Approach 2:
The patent employs composite material structures combining organic insulation layers with inorganic ultra-thin films (such as silicon oxide, silicon nitride, or low-k materials). This composite approach achieves both the required fine-line patterning precision and manufacturing compatibility by leveraging the strengths of each material type
2Manufacturing precision
If the insulation layer is made thinner to improve fine-line patterning, then manufacturing precision improves, but mechanical strength and resistance to cracking deteriorate
Solution Approach 1:
The patent uses composite structures where an ultra-thin inorganic insulation film (1-5 μm) is integrated with organic insulation layers and reinforcing structures (glass fibers). This composite design provides both the thinness required for fine-line patterning and the mechanical strength needed to prevent cracking under thermal stress
Solution Approach 2:
The patent applies different material properties to different regions: the ultra-thin inorganic film provides local insulation and adhesion for fine-line patterning, while the surrounding organic matrix and glass fiber reinforcements provide overall mechanical strength and crack resistance. This local differentiation of material qualities resolves the contradiction between thinness and strength
3Manufacturing precision
If fine-line pattern metal traces are provided, then manufacturing precision improves, but the component carrier becomes more prone to cracking under thermal impact
Solution Approach 1:
The patent employs composite insulation structures with ultra-thin inorganic films combined with organic matrices having controlled thermal expansion coefficients. This composite design accommodates thermal stress while maintaining fine-line pattern integrity, preventing cracking under thermal impact
Solution Approach 2:
The patent optimizes the thickness parameter of the ultra-thin insulation film to 1-5 μm, which is thin enough to enable fine-line patterning but thick enough to provide sufficient stress distribution and prevent cracking. Additionally, the film material selection (silicon oxide, silicon nitride, low-k materials) is optimized for thermal stress resistance
Data Source
AI summary
A component carrier including i) an inorganic carrier structure; ii) an electrically insulating layer structure comprising resin and reinforcing structures on the inorganic carrier structure; iii) an ultra-thin insulation film on the electrically insulating layer structure; and iv) an electrically conductive structure with a fine line pattern directly on the ultra-thin insulation film.