Embedded Conductive Block Component Carrier for Heat Dissipation

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Solution Overview

Problem

Existing component carriers face challenges in efficiently embedding components and managing heat dissipation, especially with increasing miniaturization and the number of components, which requires improved thermal and electrical conductivity.

Innovation Solution

A component carrier is designed with a stack comprising electrically conductive and insulating layers, embedding a semiconductor component, and a highly conductive block with a sinter connection structure. The block is thermally and electrically coupled with the semiconductor component through the conductive layer structure, allowing for efficient heat removal and current conduction.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If the number of components and their contacts are increased with smaller spacing, then product functionalities are enhanced, but heat removal becomes increasingly difficult

Engineering Contradiction:

Improveproduct functionalitiesVSAvoidheat removal

Core Design Contradiction:

Adaptability or versatilityVSTemperature

Solution Approach 1:

The patent transitions from planar heat dissipation to three-dimensional heat management by embedding semiconductor components and highly conductive blocks within a stacked component carrier structure. This vertical integration allows heat to be conducted away through multiple dimensional pathways, effectively managing thermal loads from high-density component arrangements.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent introduces highly conductive blocks as intermediary elements between semiconductor components and the component carrier substrate. These blocks serve as thermal and electrical mediators, efficiently conducting heat and current from the embedded semiconductor components to the broader carrier structure.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Volume of moving object

If components are embedded in the component carrier, then space utilization is improved, but embedding efficiency and thermal coupling remain challenging

Engineering Contradiction:

Improvespace utilizationVSAvoidembedding efficiency

Core Design Contradiction:

Volume of moving objectVSEase of manufacture

Solution Approach 1:

The patent employs preliminary actions in the manufacturing process by pre-forming cavities and preparing highly conductive blocks with connection structures before final assembly. The component carrier is prepared with designated embedding zones and conductive pathways in advance, facilitating efficient subsequent integration of semiconductor components.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent implements a nested structure where semiconductor components are embedded within cavities of the component carrier, and highly conductive blocks are positioned within the same carrier structure. This nested arrangement maximizes space utilization while maintaining accessible connection points for thermal and electrical coupling.

Inventive Principle:

Principle #7Nested doll (Nesting)

3Reliability

If highly conductive blocks are embedded to improve thermal and electrical conductivity, then heat dissipation and current conduction are enhanced, but the structural complexity increases

Engineering Contradiction:

Improveelectrical reliabilityVSAvoidstructural complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The highly conductive blocks in the patent serve multiple functions simultaneously: they act as thermal conduits for heat dissipation, electrical conductors for current flow, and mechanical anchors for securing semiconductor components. This multi-functionality reduces the need for separate dedicated structures for each function, thereby limiting the increase in overall structural complexity.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent merges thermal management and electrical conduction functions into a single integrated structure by using highly conductive blocks that perform both roles. This consolidation eliminates the need for separate thermal pathways and electrical traces, simplifying the overall design despite the enhanced functionality.

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enhances the thermal and electrical performance of the component carrier, enabling efficient heat dissipation and high-current conductivity while maintaining mechanical robustness and electrical reliability.

Implementation Method 1

the sinter connection structure of the highly conductive block is connected to the electrically conductive layer structure delimiting a bottom of the cavity so that the highly conductive block is thermally coupled with the semiconductor component

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

Methodology Applied

Scientific EffectElectrical conduction: Conduction (electrical)

Data Source

PatentEP3716321B1Component carrier with embedded semiconductor component and embedded highly conductive block which are mutually coupled

Publication Date: 2025.01.29 AT & S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AG

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AI summary

Component carrier (100) comprising a stack (102) which comprises at least one electrically conductive layer structure (104) and/or at least one electrically insulating layer structure (106), a semiconductor component (108) embedded in the stack (102), and a highly conductive block (110) embedded in the stack (102) and being thermally and/or electrically coupled with the semiconductor component (108).