Component Carrier Layout With Local High-Density Interconnects

The patent implements connection regions with spatially varying density characteristics. High density connection regions are localized at specific areas where surface mounted components are positioned, while other areas maintain lower connection density. This local differentiation optimizes electrical connection efficiency at component interfaces without uniformly increasing manufacturing complexity across the entire substrate, thereby resolving the contradiction between connection reliability and manufacturing complexity.

The patent concentrates high connection density regions specifically at locations where surface mounted components are mounted, rather than distributing high density connections uniformly across the entire substrate. This localized approach enhances signal quality at critical component interfaces while minimizing the overall structural disturbance that causes delamination and warpage, thus resolving the contradiction between signal quality and structural stability.

The patent maintains conventional manufacturing processes for the majority of the substrate while introducing localized high density connection regions specifically at areas where surface mounted components are positioned. This approach preserves manufacturing simplicity for standard areas while achieving superior electrical connection efficiency and heat removal performance at critical component interfaces, resolving the contradiction between manufacturing ease and connection reliability.