Component Carrier Interface Structure for Non-Copper Terminal Integration
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Solution Overview
Problem
Conventional component carriers face limitations in integrating semiconductor components with terminal metallization other than copper, as gold, which is commonly used, cannot be interconnected via wet (galvanic) copper processes, reducing options for embedding such components.
Innovation Solution
A component carrier and manufacturing method that include a stack with an electrically conductive or insulating layer structure, a recess exposing a terminal made of a first conductive material, and an interface structure coated with a second conductive material, enabling galvanic copper deposition on non-copper terminals through processes like metal deposition and sputtering.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If gold is used as terminal metallization for semiconductor components, then resistance to oxidation and wire bonding properties are improved, but compatibility with wet (galvanic) copper processes deteriorates
Solution Approach 1:
The patent introduces an interface structure comprising a first electrically conductive material layer deposited on the gold terminal and a second electrically conductive material layer deposited on the first layer. This interface structure acts as an intermediary between the gold terminal and the galvanic copper process, enabling the copper plating to adhere to the terminal while maintaining the oxidation resistance and wire bonding properties of the gold terminal.
2Ease of manufacture
If conventional embedding methods are used for non-copper terminals, then manufacturing simplicity is maintained, but integration flexibility deteriorates
Solution Approach 1:
The patent creates a universal interface structure that can accommodate various terminal materials (gold, aluminum, copper, or no terminal metallization). The interface structure with its two-layer electrically conductive material configuration provides a standardized approach that works with different terminal types, enabling flexible component integration while maintaining compatibility with conventional galvanic copper processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for the flexible integration of components with various terminal materials, reducing manufacturing costs and eliminating the need for a copper foil seed layer, thereby increasing embedding flexibility and reducing limitations for component manufacturers and users.
Implementation Method 1
metal deposition and sputtering processes (thin film deposition) can be used
Implementation Method 2
metal deposition and sputtering processes (thin film deposition) can be used
Data Source
AI summary
A component carrier includes a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, a component including a terminal made of a first electrically conductive material and being embedded in the stack, a recess in the stack exposing at least a part of the terminal, an interface structure on the at least partially exposed terminal and an electrically conductive structure on the interface structure made of a second electrically conductive material.