Component Carrier Protective Layer for Dense Solder Pad Isolation
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Solution Overview
Problem
The challenge in manufacturing component carriers is to ensure proper electrical connections while minimizing defects such as electric shorts, particularly in the context of increasing miniaturization and packing density, without significant additional effort or disadvantages.
Innovation Solution
A component carrier design featuring a protective layer structure with a central portion and peripheral portion of different thickness distributions, where the peripheral portion extends differently from the central portion, providing enhanced protection and facilitating reliable soldering processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If miniaturization and packing density are increased, then more components can be accommodated on the component carrier, but the risk of electric shorts and manufacturing defects increases
Solution Approach 1:
The protective layer structure is designed with spatially varying thickness: a first thickness in a central region and a second thickness (greater than the first) in a peripheral region. This local differentiation provides enhanced protection at critical areas where electric shorts are more likely to occur due to miniaturization, while maintaining adequate protection across the entire component carrier surface.
2Quantity of substance
If connection portions are made smaller to achieve higher density, then packing density improves, but manufacturing precision requirements increase
Solution Approach 1:
The protective layer structure with its varied thickness profile serves as a preventive measure against manufacturing defects. The enhanced peripheral thickness provides a buffer zone that compensates for potential manufacturing variations and tolerances, reducing the risk of defects before they can manifest during assembly or operation.
3Reliability
If protective coverage is increased to reduce defects, then reliability improves, but manufacturing complexity increases
Solution Approach 1:
Rather than uniformly increasing protective layer thickness across the entire component carrier, the invention applies different thicknesses locally: a thinner first thickness in the central region and a thicker second thickness in the peripheral region. This localized approach enhances reliability where it is most needed while avoiding unnecessary complexity and material usage in areas where less protection is required.
Data Source
Figure 1a~1b
Figure 2a~2b
Figure 3
AI summary
The present invention relates to a component carrier (100) comprising a stack (10), a manufacturing method for a component carrier (100) and a package comprising a component carrier (100), wherein said stack (100) comprises an electrically conductive layer structure (11), and a solder resist layer structure (14), wherein said electrically conductive layer structure (11) and said solder resist layer structure (14) being arranged in a stacking direction (Z). Said solder resist layer structure (14) comprises at least one opening (17) by which a portion (18) of the at least one electrically conductive layer structure (11) is exposed, wherein at least on a part of said exposed portion (18) of the at least one electrically conductive layer structure (11) at least one protective layer structure (12) is provided. Said protective layer structure (12) comprises an at least substantially plate-shaped central portion (12A) having a first thickness distribution (dcp = f (X, Y)) and an at least substantially wall-shaped peripheral portion (12B) having a second thickness distribution (dpp = f (hw, X, Y)). Said central portion (12A) is at least partially in contact with the exposed portion (18). Said peripheral portion (12B) is at least partially provided at an external side of the central portion (12A) and extends least partially in a direction (hw) different from a plate extension direction (X, Y) of the central portion (12A, B), wherein the first thickness distribution (dcp = f (X, Y)) is different from the second thickness distribution (dpp = f (hw, X, Y)).