Component Carrier Paste Via Structure for Dense Layer Interconnection
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Solution Overview
Problem
The challenge lies in efficiently interconnecting multiple layers of component carriers with small spacing between contacts while ensuring mechanical robustness and electrical reliability, particularly in harsh conditions, and effectively managing heat generated by electronic components.
Innovation Solution
A component carrier design featuring a stack with electrically insulating and conductive layer structures, utilizing an electrically conductive paste within a cavity that misaligns its vertical extremities' centers of gravity, allowing for reliable electrical and mechanical connections through deformation under pressure and temperature, facilitated by the deformable nature of the paste.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If electronic components are miniaturized and densely packed with smaller spacing between contacts, then product functionalities and component density increase, but heat removal becomes increasingly difficult and mechanical robustness decreases
Solution Approach 1:
The patent employs a composite layer structure combining electrically insulating layers with thermally conductive but electrically insulating materials. This composite approach allows dense component packing while managing heat dissipation, as the insulating layers provide both electrical isolation and thermal management capabilities simultaneously.
Solution Approach 2:
The patent introduces a vertical stacking dimension with multiple layers arranged in the Z-direction. By transitioning from planar to three-dimensional layer structures, the design achieves higher component density while providing multiple pathways for heat removal through the stack, addressing both density and thermal management requirements.
2Ease of manufacture
If layers are interconnected using paste in a conventional aligned manner, then manufacturing is simpler, but connection reliability under shear forces and harsh conditions is insufficient
Solution Approach 1:
The patent deliberately introduces misalignment between the centers of gravity of paste regions in adjacent layers. This asymmetric design creates a mechanical interlocking effect that enhances connection reliability under shear forces and thermal stress, while the paste application process remains relatively simple.
Solution Approach 2:
The paste regions are designed with curved or rounded boundaries rather than sharp angular edges. This curvature allows the paste to better conform to the cavity shapes and adjacent layer surfaces, improving mechanical interlocking and stress distribution, thereby enhancing connection reliability.
3Strength
If the component carrier must be mechanically robust for harsh conditions, then structural strength increases, but adaptability to different mounting configurations and heat management strategies decreases
Solution Approach 1:
The patent designs the layer structures and paste configurations to serve multiple functions simultaneously. The same structural elements provide both mechanical strength for harsh conditions and adaptability for different mounting configurations, eliminating the need for separate specialized components.
Solution Approach 2:
The patent incorporates deformable paste materials that can adapt their shape and position during assembly and operation. This dynamic capability allows the structure to maintain mechanical robustness while adapting to different mounting configurations and thermal expansion conditions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design ensures a highly reliable electrical and mechanical connection between layers, capable of withstanding shear forces and heat management, while maintaining compactness and reducing internal tension.
Implementation Method 1
the deformable nature of the paste... allowing for reliable electrical and mechanical connections through deformation under pressure and temperature
Implementation Method 2
said electrically conductive paste being in contact with said at least two electrically conductive layer structures
Data Source
AI summary
A component carrier having a stack with at least one electrically insulating layer structure and at least two electrically conductive layer structures, and at least one electrically conductive element. The at least one electrically conductive element passes through the at least one electrically insulating layer structure, preferably in a stacking direction. The at least one electrically conductive element comprises an electrically conductive paste provided in a cavity being located at least partially within the at least one electrically insulating layer structure. The electrically conductive paste is in contact with the at least two electrically conductive layer structures, wherein the center of gravity of one vertical extremity of the at least one electrically conductive element is misaligned with respect to the center of gravity of the opposed other vertical extremity of the at least one electrically conductive element.