Component Carrier Resin Flow Control for Embedding Stability
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Solution Overview
Problem
Existing component carriers, such as printed circuit boards, face challenges in efficiently and stably embedding components due to limitations in build-up thickness and mechanical stability, particularly with larger components and increased miniaturization.
Innovation Solution
A component carrier with a multi-layer stack comprising a core layer and distinct resin flow portions from two electrically insulating layer structures extending into a cavity, allowing for controlled resin flow and adaptation to the component's requirements, thereby enabling higher build-up thickness and improved mechanical stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If conventional embedding approach with single resin layer is used, then manufacturing process is simple, but build-up thickness is limited to around 350 μm and mechanical stability is reduced
Solution Approach 1:
The single resin layer is segmented into multiple electrically insulating layer structures (first and second layers) with different resin flow properties. This segmentation allows each layer to contribute differently to the embedding process, enabling greater build-up thickness while maintaining manufacturability through controlled resin flow from each segment.
Solution Approach 2:
The patent uses composite material structures by combining multiple electrically insulating layers with different compositions and resin flow characteristics. This composite approach allows the stack to achieve higher build-up thickness while maintaining mechanical stability, as each material layer contributes its specific properties to the overall structure.
2Adaptability or versatility
If higher build-up is achieved with larger components, then component size adaptability is improved, but unfilled space between component and surrounding material occurs
Solution Approach 1:
Different electrically insulating layers are assigned different resin flow properties tailored to specific regions and requirements. The first and second layers have distinct flow characteristics that enable them to fill different portions of the cavity, ensuring complete filling for components of varying sizes while maintaining manufacturing precision.
Solution Approach 2:
The patent changes the resin flow parameters (viscosity, flow rate, flow direction) of different electrically insulating layers to adapt to varying component sizes and cavity configurations. By controlling these parameters, the system achieves complete cavity filling across different component dimensions without compromising manufacturing precision.
3Reliability
If multiple electrically insulating layer structures with distinct resin flow are used, then cavity filling and mechanical stability are improved, but manufacturing process complexity increases
Solution Approach 1:
The different electrically insulating layers are prepared in advance with predetermined resin flow properties and positions in the stack. This preliminary configuration allows the resin flow behavior to be controlled during manufacturing, achieving reliable embedding stability without significantly increasing process complexity, as the layers are pre-configured to perform their specific functions.
Data Source
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AI summary
There is described a component carrier (100) having a stack (101) that comprises: i) a core layer (110); ii) a first electrically insulating layer structure (120) arranged on a first main surface of the core layer (110); iii) a second electrically insulating layer structure (130) arranged on a second main surface of the core layer (110), wherein the second main surface is opposed to the first main surface; iv) a cavity (140) in the core layer (110), wherein the core layer (110) defines a cavity lateral wall (145); v) a component (150) with a component lateral wall (155), at least partially inserted in said cavity (140). The first electrically insulating layer structure (120) and the second electrically insulating layer structure (130) extend at least partially into the cavity (140), so that in a region (160) between the cavity lateral wall (145) and the component lateral wall (155), a first distinct resin flowed portion (126) of the first electrically insulating layer structure (120) and a second distinct resin flowed portion (136) of the second electrically insulating layer structure (130) are provided.