Component Carrier Tapering Trench for Low-Loss RF Traces
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Solution Overview
Problem
Component carriers face challenges in reducing losses and improving RF signal transmission characteristics due to increasing heat generation and electromagnetic interference, while requiring mechanical robustness and efficient electromagnetic shielding.
Innovation Solution
A component carrier with a stack comprising electrically conductive and insulating layers, featuring a tapering trench beneath and beside traces to reduce dielectric material and effective permittivity, thereby minimizing signal loss and electromagnetic coupling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If dielectric material is removed to reduce effective permittivity and signal loss, then RF signal transmission characteristics improve, but mechanical robustness deteriorates
Solution Approach 1:
The patent applies local quality by creating a tapering trench only in specific regions beneath and beside the traces, rather than removing dielectric material uniformly throughout the component carrier. This localized removal reduces effective permittivity and signal loss in the critical RF transmission areas while preserving mechanical strength in other regions of the carrier structure.
Solution Approach 2:
The patent changes the physical parameters of the dielectric material distribution by creating a tapering trench with varying depth and width. The trench depth increases from the trace level downward, creating a gradual transition in dielectric material density. This parameter change optimizes the balance between reducing effective permittivity for better RF performance and maintaining sufficient dielectric material for mechanical support.
2Object-affected harmful factors
If tapering trench is formed to reduce electromagnetic coupling, then electromagnetic interference protection improves, but manufacturing complexity increases
Solution Approach 1:
The patent addresses electromagnetic coupling by introducing a vertical dimension to the trench structure. Instead of using simple lateral spacing between traces, the tapering trench extends vertically beneath the traces, creating a three-dimensional isolation structure. This vertical separation in the depth dimension effectively reduces electromagnetic coupling between adjacent traces on the same layer or adjacent layers.
Solution Approach 2:
The patent segments the dielectric material removal into distinct zones: the tapering trench region beneath the traces, the lateral trenches beside the traces, and the remaining intact dielectric material in other areas. This segmentation allows selective electromagnetic isolation where needed while preserving mechanical strength and simplifying manufacturing in non-critical areas.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution results in faster signal speed, reduced insertion loss, and improved mechanical robustness, effectively addressing the challenges of heat dissipation and electromagnetic interference.
Implementation Method 1
by forming a tapering trench in the at least one electrically insulating layer structure beside and below the first trace, i.e., be removing dielectric material on at least one side of the first trace, the effective permittivity (also referred to as effective dielectric constant or Dk) is significantly reduced. The lower permittivity results in a lower group delay or faster signal speed
Implementation Method 2
The lower permittivity results in a lower group delay or faster signal speed, less insertion loss due to lower dielectric loss (also referred to as dissipation factor Df)
Implementation Method 3
less electromagnetic coupling between two adjacent traces
Data Source
AI summary
A component carrier includes a stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure. The at least one electrically conductive layer structure includes a first trace. A tapering trench is formed in the at least one electrically insulating layer structure beside and below the first trace. A method of manufacturing the component carrier is also described.