Component Carrier Stacks Connected by Intermediate Layer
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Solution Overview
Problem
Existing methods struggle to efficiently embed components at different vertical heights in component carriers while ensuring mechanical robustness, electrical reliability, and effective heat dissipation, particularly in multi-core structures with increasing complexity and miniaturization.
Innovation Solution
A component carrier design featuring two stacks interconnected by an intermediate layer with a stiffening layer and resin portions that fill gaps between components, allowing uncured resin to flow into cavities for encapsulation, providing mechanical stability and efficient heat distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple cores/stacks with embedded components are required at different vertical heights, then component functionality and integration density are improved, but the manufacturing process complexity increases significantly
Solution Approach 1:
The component carrier is divided into multiple independent stacks (first stack, second stack, etc.) that can be manufactured separately and then connected through intermediate layers. Each stack can contain embedded components at different vertical heights, allowing complex functionality to be achieved through modular assembly rather than monolithic manufacturing
Solution Approach 2:
Intermediate layers are introduced between stacks to connect them together. These intermediate layers contain resin portions that flow into cavities in the stacks during curing, providing mechanical bonding and electrical connectivity while simplifying the overall manufacturing process by enabling sequential assembly
2Manufacturing precision
If conventional embedding processes are repeated for each core layer individually, then components can be embedded in each layer, but production time and manufacturing cycles increase
Solution Approach 1:
Stacks are prepared in advance with pre-formed cavities and embedded components before the final assembly stage. This preliminary preparation allows for precise component embedding to be performed on individual stacks independently, and then the stacks are quickly connected through intermediate layers, reducing the overall production cycle
Solution Approach 2:
Multiple stacks with their respective embedded components are merged together through intermediate layers in a single assembly process. This combining approach allows several embedding operations to be performed in parallel on different stacks, then consolidated, thereby reducing total production time compared to sequential processing
3Adaptability or versatility
If thicker stack-ups are used to accommodate multiple embedded components, then component integration is achieved, but mechanical robustness and warpage control deteriorate
Solution Approach 1:
The intermediate layers are designed with localized resin portions that flow into specific cavities in the stacks. This local quality approach allows the intermediate layers to provide targeted mechanical support and bonding at specific locations, enhancing overall structural stability without requiring uniform thickness increases throughout the entire stack-up
Solution Approach 2:
The component carrier employs composite structures combining multiple materials: conductive and insulating layer structures within stacks, resin matrices in intermediate layers, and reinforcing fibers or fillers. These composite materials provide enhanced mechanical properties and warpage control while accommodating high-density component integration at different vertical heights
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables efficient embedding of components at different vertical heights with improved mechanical stability, reduced warpage, and enhanced heat dissipation, while allowing for thinner stack-ups and shorter production cycles.
Implementation Method 1
the cavities are open towards the intermediate layer, so that resin from the intermediate layer flows at least partially into the respective cavities, thereby embedding the respective component
Implementation Method 2
an intermediate layer (in particular an inlay; comprising three or more layers), wherein the intermediate layer is arranged between the first stack and the second stack, and comprises: iiia) a stiffening layer (e.g. an already cured layer such as a core layer) comprising a stiffening structure (e.g. in form of a mesh, for example (glass) fibers) in an intermediate resin portion
Data Source
Figure 1A~1B
Figure 2A~2C
Figure 3A~3E
AI summary
There is described a component carrier (150), wherein the component carrier (150) comprises: i) a first stack (160) comprising at least one first electrically conductive layer structure (164) and at least one first electrically insulating layer structure (162), and having a first cavity (166) in which a first component (165) is embedded, wherein said first cavity (166) is open on a first main surface of the first stack (160); ii) a second stack (170) comprising at least one second electrically conductive layer structure (174) and at least one second electrically insulating layer structure (172), and having a second cavity (176) in which a second component (175) is embedded, wherein the second cavity (176) is open on a second main surface of the second stack (170) and faces the first main surface of the first stack (160); iii) an intermediate layer (100), wherein the intermediate layer (100) is arranged between the first stack (160) and the second stack (170), and comprises: a) stiffening layer (110) comprising a stiffening structure in an intermediate resin portion (110), b) a first resin portion (120) arranged at a first main surface (115) of the stiffening layer (110), wherein the first resin portion (120) is arranged at least partially in gaps (167) of the open first cavity (166) between the first component (165) and the first stack (160), and c) a second resin portion (130) arranged at a second main surface (116) of the stiffening layer (110) opposed to the first main surface (115), wherein the second resin portion (130) is arranged at least partially in gaps (177) of the open second cavity (176) between the second component (175) and the second stack (170).