Component Carrier Toughness via Stress Suppressing Particles
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Solution Overview
Problem
Miniaturized component carriers face mechanical stress and potential cracking due to repeated temperature changes, exacerbated by differing thermal expansion characteristics between materials.
Innovation Solution
Incorporation of stress propagation suppressing particles, such as dielectric or ceramic materials, within the component carrier's stack to adjust thermal expansion characteristics, reducing mechanical stress and preventing crack propagation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If miniaturization of components and increasing component density are implemented, then product functionality and integration are improved, but mechanical stress and crack propagation due to thermal expansion differences are worsened
Solution Approach 1:
The patent modifies the thermal expansion parameters of the component carrier by incorporating stress propagation suppressing particles. These particles change the coefficient of thermal expansion of the carrier material to better match that of the mounted components, thereby reducing thermal stress during temperature cycling while maintaining high component density
Solution Approach 2:
The patent creates a composite material structure by combining the base component carrier material with stress propagation suppressing particles. This composite approach allows the carrier to simultaneously provide mechanical support, electrical insulation/conduction, and optimized thermal expansion characteristics to withstand repeated temperature changes
2Reliability
If repeated temperature changes are endured, then operational reliability is improved, but mechanical stress and crack propagation are worsened
Solution Approach 1:
The patent converts the harmful effect of thermal expansion differences into a beneficial outcome by adding stress propagation suppressing particles. These particles absorb and redistribute thermal stress, transforming the potentially damaging thermal cycling into a manageable operational condition that enhances long-term reliability
Solution Approach 2:
The stress propagation suppressing particles act as an intermediary between the component carrier and the mounted components. They mediate the thermal expansion differences between materials, absorbing and distributing mechanical stress to prevent crack propagation while allowing the system to endure repeated temperature changes
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively mitigates mechanical stress and cracking in component carriers by ensuring similar thermal expansion across materials, enhancing their toughness and resistance to temperature fluctuations.
Implementation Method 1
Temperature changes, for instance resulting from heat generated by the components and/or from environmental influences (e.g. solar irradiation, coldness) become a more and more challenging issue for such miniaturized component carriers. Repeated temperature changes or temperature cycles may lead to mechanical stress within the component carrier, in particular between materials exhibiting significantly different thermal expansion characteristics.
Data Source
AI summary
A component carrier is provided, which includes a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure; a component on the stack; and stress propagation suppressing particles in at least part of the stack suppressing propagation of stress through the component carrier.