Component Carrier Ultra-Thin Transition Layer for Delamination Control
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Solution Overview
Problem
Component carriers with embedded electronic components face challenges in mechanical robustness, electrical reliability, and heat dissipation due to the mismatch in materials and properties between the components and the stack, leading to issues like warpage, delamination, and stress formation.
Innovation Solution
A laminated stack with a transition layer of 0.5 nm to 1 µm thickness, made of materials like Bis(2-methoxyethyl)ether and aromatic polyamideimide, is used to enhance adhesion, mechanical, and thermal reliability by acting as a bridge between the component and the stack, suppressing delamination and stress while maintaining compactness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a component is embedded in a laminated stack with conventional direct bonding, then the assembly process is simple, but the mechanical and electrical reliability deteriorates due to material mismatch causing warpage, delamination, and stress formation
Solution Approach 1:
A transition layer with intermediate material properties is introduced between the component and the laminated stack. This transition layer acts as a mediator that gradually transitions the material properties from the component to the stack, reducing the abrupt mismatch that causes warpage, delamination, and stress. The transition layer may have graded composition or be composed of multiple sub-layers with progressively changing properties.
Solution Approach 2:
The transition layer is formed using composite material structures that combine different materials with complementary properties. This may include metal-ceramic composites, polymer-matrix composites, or multi-layer composite structures that provide both mechanical strength and thermal compatibility, bridging the gap between dissimilar materials.
2Reliability
If the transition layer thickness is increased to improve adhesion and stress management, then the reliability improves, but the overall device thickness and compactness deteriorate
Solution Approach 1:
The thickness of the transition layer is optimized to a specific range (1 μm to 100 μm) where it provides sufficient mechanical and thermal transition functionality while minimizing the increase in overall device thickness. Within this optimized thickness range, the transition layer achieves the necessary adhesion and stress management without excessive bulk.
Solution Approach 2:
The transition layer is applied selectively only at the interfaces where material mismatch and stress concentration occur, rather than uniformly throughout the entire device. This localized application provides the necessary reliability improvement at critical interfaces while minimizing the overall addition to device thickness.
3Reliability
If multiple thick protective layers are applied to ensure reliability under harsh conditions, then the reliability improves, but the device complexity and manufacturing effort increase
Solution Approach 1:
The transition layer is designed to perform multiple functions simultaneously: providing mechanical adhesion between dissimilar materials, managing thermal expansion mismatch, offering electrical insulation or conductivity as needed, and protecting against environmental degradation. This multi-functionality eliminates the need for separate dedicated layers for each function, simplifying the overall structure and manufacturing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The transition layer effectively improves the reliability and compactness of the component carrier by promoting adhesion, reducing warpage, and managing thermal stress without significantly altering the overall properties, ensuring reliable operation under harsh conditions.
Implementation Method 1
The transition layer may be configured for promoting adhesion between the component and the stack
Implementation Method 2
The transition layer may be configured for buffering stress between the component and the stack
Data Source
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AI summary
A method of manufacturing a component carrier (100), wherein the method comprises providing a laminated stack (102) comprising at least one electrically conductive layer structure (104) and/or at least one electrically insulating layer structure (106), at least partially covering a component (108) with a transition layer (110) having a thickness (D) in a range from 0.5 nm to 1 µm, and assembling the component (108) with the stack (102).