Electronic Component Connection Layout for Reduced Transverse Space
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Solution Overview
Problem
The existing electronic device connection structures occupy large transverse space due to the need for avoidance spaces between electronic elements, limiting the downsizing of portable devices.
Innovation Solution
An electronic element connection structure is designed where the first element and second element are arranged on two sides of a connecting board, with their vertical projections overlapping or maintaining a threshold distance, allowing for a safer interference-free space in the thickness direction, thereby reducing the transverse space occupation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If avoidance space is arranged between electronic elements in the prior art, then mutual interference between elements is prevented, but transverse space occupation increases
Solution Approach 1:
The patent transitions the avoidance space from the transverse plane (horizontal arrangement) to the thickness direction (vertical arrangement). By stacking electronic elements on different layers of the connecting board and using vertical spacing instead of horizontal spacing, the design prevents mutual interference while minimizing transverse space occupation, thereby enabling device downsizing.
2Area of stationary object
If transverse space is reduced for device downsizing, then portability is improved, but adequate avoidance space between elements becomes difficult to ensure
Solution Approach 1:
The invention utilizes the thickness direction (vertical dimension) as an alternative space for element separation. By arranging elements on different layers with adequate vertical spacing, the design maintains reliable interference prevention while minimizing the transverse footprint, thus achieving both compact size and functional reliability.
Solution Approach 2:
The patent employs a multi-layer stacked configuration where electronic elements are nested vertically on different layers of the connecting board. This nesting approach allows multiple elements to coexist in a compact transverse space by utilizing the vertical dimension, effectively reducing the device's overall footprint while maintaining adequate separation between elements.
Data Source
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AI summary
This application provides an electronic element connection structure and an electronic device, which relate to the field of electrical connection structures, to reduce the space occupied by the connection structure in the transverse size, thereby reducing the occupation of transverse space inside the electronic device, to help to reduce the external size of the electronic device. The electronic element connection structure includes a connecting board, a first element, and a second element. The first element is connected to one side of the connecting board, and the second element is connected to an other side of the connecting board. A vertical projection of the first element on a preset plane overlaps with a vertical projection of the second element on the preset plane, where the preset plane is parallel to a plane on which one of the sides of the connecting board is located. A distance between the first element and the second element in a direction perpendicular to the preset plane is greater than or equal to a threshold distance.