Electronic Component Contained Substrate With Through-Hole Nesting
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing electronic component contained substrates face challenges in reducing thickness and planar dimensions due to enlarged solder ball diameters and alignment intervals, limiting the thinning of semiconductor devices when stacking multiple substrates.
Innovation Solution
The solution involves a pair of wiring substrates with an electronic component mounted between them, where one substrate has an opening larger than the electronic component, allowing it to be aligned within the opening and reducing the distance between substrates, enabling smaller solder balls and a reduced thickness, along with improved heat radiation and mechanical strength using core-contained solder balls.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the electronic component is mounted between two wiring substrates with sealing resin filling the space, then the structure is sealed and electrically connected, but the total thickness and planar dimension are increased due to enlarged solder ball diameter and alignment interval
Solution Approach 1:
The electronic component is inserted into a through-hole formed in the second wiring substrate, allowing the component to be nested within the substrate thickness rather than occupying external space. This nesting approach reduces the overall thickness of the assembled structure while maintaining the electrical connection function through solder balls at the bottom of the through-hole.
Solution Approach 2:
The invention transitions from a planar mounting approach to a three-dimensional through-hole insertion approach. By forming a through-hole in the second wiring substrate and inserting the electronic component vertically into it, the structure utilizes the thickness dimension more efficiently, reducing the planar footprint and overall height of the assembly.
2Reliability
If the electronic component is mounted between two wiring substrates with sealing resin, then the structure is sealed, but the planar dimension is increased due to enlarged alignment interval of solder balls
Solution Approach 1:
The electronic component is nested within the through-hole of the second wiring substrate, which confines the component and its associated solder balls within a smaller planar area. The through-hole acts as a container that limits the lateral spread of the assembly, thereby reducing the overall planar dimension while maintaining sealing integrity.
Solution Approach 2:
The second wiring substrate is designed with a localized through-hole feature that provides a concentrated mounting area for the electronic component. This local structural modification allows the solder balls and component to be confined to a specific region, reducing the required alignment interval and overall planar dimension of the sealed structure.
3Length of stationary object
If multiple electronic component contained substrates are stacked to reduce total thickness, then the device becomes thinner, but the thickness reduction is limited by the minimum achievable substrate and component thickness
Solution Approach 1:
The electronic component is nested within the through-hole of the second wiring substrate, allowing the component thickness to be effectively absorbed into the substrate thickness. This nesting configuration enables thinner overall assemblies because the component does not add to the external thickness dimension in the same way as surface-mounted configurations.
Solution Approach 2:
The second wiring substrate is segmented by forming a through-hole that passes through its thickness, creating distinct regions for electrical connection (bottom of hole) and sealing (top surface). This segmentation allows the electronic component to be positioned within the substrate volume rather than on its external surfaces, facilitating thinner overall device design when stacking multiple substrates.
Data Source
AI summary
An electronic component contained substrate in which an electronic component is mounted between a pair of wiring substrates, wherein the wiring substrates are connected electrically via solder balls, an opening portion opened larger than a planar shape of the electronic component is formed in the other wiring substrate, which faces to one wiring substrate on which the electronic component is mounted, in a position that opposes the electronic component, and a space between a pair of wiring substrates is sealed with a sealing resin.