Component Coupling System for Controlled Heat Transfer
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Solution Overview
Problem
Existing temperature control devices face challenges in maintaining constant high temperatures up to 1500°C, especially under vacuum conditions, due to inefficient heat transfer and adhesion issues between components, leading to heat loss and reduced contact surface area.
Innovation Solution
A component coupling system with a carrier plate and sealing elements creates a defined cavity for controlled heat transfer, using high-temperature resistant materials like TZM and ceramics, and allows for fluid or vacuum medium flow to enhance heat exchange, while maintaining a sealed environment for reproducible temperature control.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If direct planar contact is used between components for heat transfer, then heat transfer efficiency is improved, but adhesion accumulates and reduces contact surface area
Solution Approach 1:
The sealing element is divided into a sealing body and a sealing lip, with the sealing lip being replaceable. This segmentation allows the sealing lip to be renewed after wear or adhesion accumulation, maintaining effective sealing contact without replacing the entire sealing element, thus preserving contact surface area and heat transfer efficiency.
Solution Approach 2:
The sealing lip is designed as a consumable component that can be replaced when it becomes contaminated with adhesion or wears out. By discarding the worn sealing lip and installing a new one, the sealing surface is recovered, ensuring continuous effective contact between components for reliable heat transfer.
2Temperature
If high temperature resistant materials are used, then temperature control capability is improved, but device complexity increases
Solution Approach 1:
The sealing element uses a composite structure combining a sealing body made of high-temperature resistant material (such as ceramic or refractory material) and a sealing lip made of flexible material (such as graphite or rubber). This composite approach enables the device to withstand high temperatures up to 1500°C while maintaining sealing effectiveness through the flexible lip that can accommodate thermal expansion and surface irregularities.
3Object-affected harmful factors
If vacuum conditions are used, then material integrity is improved, but heat transfer efficiency deteriorates
Solution Approach 1:
A fluid medium (such as inert gas or liquid) is introduced as an intermediary between the components in the vacuum chamber. This fluid medium enables efficient heat transfer through convection and conduction while the vacuum environment outside prevents oxidation of the material sample. The sealing element creates a sealed cavity that contains the fluid medium, allowing these two seemingly contradictory conditions to coexist.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables deliberate and controllable heat transfer, maintaining components at constant temperatures from room temperature to 1500°C, reducing heat loss and adhesion issues, and allowing for efficient heating and cooling processes.
Implementation Method 1
a carrier plate (1), by way of which a heat transfer to the component (3) or away from the component (3) can take place
Implementation Method 2
at least one means (2a) for spacing a component (3) in relation to the carrier plate (1), which means (2a) is disposed on the carrier plate (1)
Implementation Method 3
which can be heated by way of an internal heater and/or an external heat supply to temperatures of up to 1500° C.
Implementation Method 4
disposed adjacent to a cooler so that the component can also be cooled to room temperature again
Data Source
AI summary
A component coupling system for controllable heat transfer from or to a component which is heated by an external and/or internal heat source and is disposed adjacent to a cooler. The component coupling system includes a carrier plate, on which least one first means for spacing is disposed such that a component disposed on the means for spacing and the carrier plate, together with the means for spacing, form a first cavity. If needed, this cavity can be evacuated, filled with a fluid medium, or have a fluid medium flow through it, whereby the heat transfer or the heat dissipation from the component can be controlled in a simple manner.