Electronic Component Package Cover Reinforcement
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Solution Overview
Problem
Conventional electronic component packages, such as SAW devices, are prone to damage from pressure and shock due to the thinness of the component cover where a cavity is present, which can be exacerbated by the mold resin during mounting and coating processes.
Innovation Solution
The electronic component package design includes a component cover with concave sections and strategically placed ground or dummy electrodes on the surface, which reduces the thin area's thickness and disperses pressure, preventing damage by using these electrodes to support the mold resin and distribute external pressure effectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a cavity is provided in the component cover to prevent contact between the cover and IDT electrodes, then the risk of electrode contact is reduced, but the component cover becomes very thin and vulnerable to damage from mold resin pressure
Solution Approach 1:
The patent applies local quality by providing reinforcement structures (protrusions or thickened portions) at specific locations on the component cover where it contacts the mounting substrate, while maintaining thin walls in other areas to preserve the cavity function. This localized reinforcement strengthens the cover against mold resin pressure without compromising the electrode contact prevention function.
Solution Approach 2:
The component cover is segmented into different functional zones: thin-walled portions that form the cavity for preventing electrode contact, and reinforced portions (protrusions or thickened areas) that contact the mounting substrate to distribute and withstand mold resin pressure. This segmentation allows each zone to optimize its specific function.
2Volume of stationary object
If the component cover is made thinner to create the cavity space, then the cavity volume increases for better electrode isolation, but the overall structural strength decreases making the package vulnerable to shock and pressure
Solution Approach 1:
The component cover employs local quality by having thin-walled sections in the cavity formation areas to maximize cavity volume for electrode isolation, while simultaneously having localized reinforced sections (protrusions or thickened portions) at the mounting substrate contact areas to maintain overall structural strength and resist external pressure and shock.
Solution Approach 2:
The cover structure is segmented into thin-walled cavity-forming portions and reinforced load-bearing portions, allowing the thin sections to provide maximum cavity volume while the reinforced sections provide the necessary structural strength to withstand external forces.
Data Source
AI summary
An electronic component package comprises: an electronic component where device elements are mounted inside cavities formed between a component substrate and a component cover that covers the component substrate; and a mounting substrate. The component cover is placed on the mounting substrate, and the electronic component is mounted on the mounting substrate and molded by a resin. At least one of a ground electrode and a dummy electrode is provided on a surface of the component cover, the surface being placed on the mounting substrate. At least one of the ground electrode and the dummy electrode is provided in a position opposed to at least part of the cavities.