Component-embedded substrate bump positioning for dense mounting
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Solution Overview
Problem
Conventional component-embedded substrates face difficulties in densely mounting surface-mount components due to the placement of element-mounting areas directly above internal components, leading to issues with surface-mount component positioning and defective joints.
Innovation Solution
A component-embedded substrate with a multilayer thermoplastic substrate and surface-mount components mounted using bumps, where the surface-mount components are positioned to cross the outline of internal components, with bumps located 50 μm or more from the internal component outline, allowing for improved mounting density and reduced defective joints.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If element-mounting areas are provided directly above internal components, then terminal connecting portions can be formed for surface-mount components, but surface-mount components cannot be disposed densely on the substrate surface
Solution Approach 1:
The patent allows surface-mount components to be positioned in the lateral dimension (crossing the outline of internal components) rather than being restricted to the vertical dimension (directly above internal components). This dimensional change enables components to be mounted in previously unusable spaces, increasing mounting density while maintaining terminal connection functionality.
2Productivity
If surface-mount components are positioned to increase mounting density, then more components can be mounted on the substrate, but defective joints increase due to insufficient thermoplastic resin filling
Solution Approach 1:
The patent specifies a critical parameter: the distance between bumps on surface-mount components and the outline of internal components must be 50 μm or more. This parameter change ensures sufficient thermoplastic resin filling distance, preventing resin deficiency and reducing defective joints while maintaining high mounting density.
3Productivity
If bumps are positioned closer to internal components to improve mounting density, then space is utilized more efficiently, but slipping occurs leading to defective joints
Solution Approach 1:
The patent establishes a minimum distance parameter of 50 μm between bumps and internal component outlines. This parameter prevents slipping by ensuring adequate thermoplastic resin coverage and bonding area, while still allowing compact component placement to maximize space utilization.
Data Source
AI summary
A component-embedded substrate having a multilayer substrate formed by laminating a plurality of thermoplastic sheets in a predetermined direction, an internal component provided in the multilayer substrate, and a surface-mount component mounted on a surface of the multilayer substrate using bumps. The surface-mount component, when viewed in a plan view in the predetermined direction, is positioned so as to cross an outline of the internal component, with the bumps on the surface-mount component located 50 μm or more from the outline of the internal component.