Component-Embedded Substrate With Nested ICs for Compact Routing
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Solution Overview
Problem
Existing multilayer printed circuit boards face challenges in reducing size while maintaining high-density component mounting, as internal wires become increasingly difficult to route due to the proximity of electrodes, leading to a larger external size and complexity in layer stacking.
Innovation Solution
A component-embedded substrate with a multilayer structure using thermoplastic resin films, where a first embedded component with more terminals is positioned closer to the mounting electrode and covered by a second component with fewer terminals, allowing for efficient wire routing without increasing the substrate's size or layer count, and eliminating the need for additional solder layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If multiple ICs are embedded in a multilayer printed circuit board with many terminals, then the component density is improved, but the internal wires become increasingly difficult to route due to proximity
Solution Approach 1:
The patent transitions from planar wire routing to three-dimensional routing through multiple layers. By stacking resin films and forming conductive patterns on both upper and lower surfaces, the invention creates vertical pathways for internal wires, allowing complex connections without increasing the horizontal footprint of the substrate.
Solution Approach 2:
The patent embeds multiple ICs within the multilayer resin film structure, nesting components inside the substrate rather than mounting them on the surface. This nested configuration allows high-density component placement while maintaining external connection electrodes on the surface for simplified wiring.
2Device complexity
If space is provided between internal wires by adding regions in correspondence, then the wire routing difficulty is reduced, but the external shape of the multilayer printed circuit board becomes large in size
Solution Approach 1:
Instead of providing horizontal spacing between wires on a single layer, the patent utilizes the vertical dimension by creating multiple layers of resin films with conductive patterns on both upper and lower surfaces. This allows wires to be routed in three dimensions, providing necessary spacing without increasing the substrate's horizontal area.
3Reliability
If external connection electrodes are provided at the mounting surface with many IC terminals, then the electrical connectivity is improved, but the internal wires must be provided closer together making routing more difficult
Solution Approach 1:
The patent nests multiple ICs within the multilayer substrate structure, with each IC having its terminals connected to external connection electrodes through internal wires routed through the resin films. This nested configuration allows high-density connectivity while managing internal wire complexity through three-dimensional routing pathways.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables the embedding of multiple components with a large number of terminals without enlarging the substrate, simplifies the layer stacking process, and reduces electromagnetic wave emission by positioning components effectively, resulting in a compact and efficient communication module.
Implementation Method 1
heating and pressing, a multilayer substrate including a plurality of resin films stacked upon each other is obtained
Implementation Method 2
heating and pressing, a multilayer substrate including a plurality of resin films stacked upon each other is obtained
Data Source
AI summary
A component-embedded substrate includes a first embedded component positioned in a layer close to a mounting electrode and a second embedded component positioned in a layer farther away from the mounting electrode than the first embedded component. The first and second embedded components include electrically connected terminals. Each resin film of the substrate is formed of thermoplastic resin. The first embedded component has more terminals than the second embedded component. Many of the internal wires from the first and second embedded component extend towards a mounting surface where the mounting electrode is provided. However, since in plan view the area of the first embedded component is smaller than the second embedded component, and the first embedded component is disposed closer to the mounting surface than the second embedded component, there is space for routing the internal wires at the side of the mounting surface of the substrate.